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Additional organosilicon fireproof pouring sealant for electronics and preparation method thereof

A technology of silicone and potting glue, applied in chemical instruments and methods, other chemical processes, etc., can solve the problems of finished product performance, storage and mechanical properties, personnel hazards, environmental pollution, etc., to achieve a wide range of applicable temperatures , Increase the amount of addition, the effect of convenient use

Inactive Publication Date: 2012-04-04
SHANGHAI YOUNAI ORGANOSILICON MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Usually, electronic potting adhesives obtain flame retardant effects by adding halogen flame retardants or inorganic flame retardants. Halogen flame retardants have high flame retardant efficiency, but because they produce hydrogen halide gas during combustion, they are harmful to personnel, and It pollutes the environment and has been banned from use. Although the use of inorganic flame retardants has the advantages of non-toxicity, low smoke, and no corrosion, it must be added in a large amount to obtain excellent flame-retardant effects, resulting in poor performance of the finished product. The storage and mechanical properties are greatly affected

Method used

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  • Additional organosilicon fireproof pouring sealant for electronics and preparation method thereof
  • Additional organosilicon fireproof pouring sealant for electronics and preparation method thereof
  • Additional organosilicon fireproof pouring sealant for electronics and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] 100 parts of α, ω-divinyl polydimethylsiloxane with a viscosity of 500 mPas at 25±2°C, special ① Put 80 parts of aluminum hydroxide into a kneader and knead for 3 hours at a temperature of 180° C. and a vacuum of -0.08 MPa, and cool to obtain a base material. At room temperature, add 100 parts of base material, 20 parts of α, ω-divinylpolydimethylsiloxane, and 0.2 parts of platinum catalyst into the planetary mixer, keep the vacuum degree -0.08MPa, stir at 70rpm, and stir for 20 Minutes to prepare component A; at room temperature, add 100 parts of base material, 1 part of carbon black pigment slurry, 12 parts of hydrogen-containing silicone oil at the end, and 0.5 parts of vinyltrimethoxysilane into the planetary mixer, and keep the vacuum degree -0.08 MPa, the stirring speed is 70rpm, stirring for 20 minutes to prepare the B component. The product performance test results are shown in Table 1.

Embodiment 2

[0015] Put 100 parts of α, ω-divinyl polydimethylsiloxane with a viscosity of 500 mPas at 25±2°C and 80 parts of aluminum hydroxide into a kneader and knead at a temperature of 180°C and a vacuum of -0.08MPa After 3 hours, the base material was obtained after cooling. At room temperature, add 100 parts of base material, 20 parts of α, ω-divinylpolydimethylsiloxane, and 0.2 parts of platinum catalyst into the planetary mixer, keep the vacuum degree -0.08MPa, stir at 70rpm, and stir for 20 Minutes to prepare component A; at room temperature, add 100 parts of base material, 1 part of carbon black pigment slurry, 12 parts of terminal hydrogen-containing silicone oil crosslinking agent, and 0.5 part of vinyltrimethoxysilane coupling agent into the planetary mixer , keep the vacuum degree -0.08MPa, stir at 70rpm, stir for 20 minutes, and get B component. The product performance test results are shown in Table 1.

Embodiment 3

[0017] Put 100 parts of α, ω-divinyl polydimethylsiloxane with a viscosity of 500 mPas at 25±2°C and 75 parts of magnesium hydroxide into a kneader at a temperature of 180°C and a vacuum of -0.08MPa After kneading for 3 hours, the base material was obtained after cooling. At room temperature, add 100 parts of base material, 20 parts of α, ω-divinylpolydimethylsiloxane, and 0.2 parts of platinum catalyst into the planetary mixer, keep the vacuum degree -0.08MPa, stir at 70rpm, and stir for 20 Minutes to prepare component A; at room temperature, add 100 parts of base material, 1 part of carbon black pigment slurry, 12 parts of hydrogen-containing silicone oil at the end, and 0.5 parts of vinyltrimethoxysilane into the planetary mixer, and keep the vacuum degree -0.08 MPa, the stirring speed is 70rpm, stirring for 20 minutes to prepare the B component. The product performance test results are shown in Table 1.

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Abstract

The invention discloses an additional organosilicon fireproof pouring sealant for electronics and a preparation method thereof. The preparation method comprises the following steps that alpha, ohm-divinylpolydimethylsiloxane as a base material, a special inorganic fire retardant as a fire retardant, an appropriate amount of an inorganic filling material as an improvement agent, and appropriate amounts of a cross-linking agent, a coupling agent and a catalyst are respectively prepared into a component A and a component B; the component A and the component B undergo a heating sulfuration addition reaction to produce the additional organosilicon fireproof pouring sealant for electronics, wherein the additional organosilicon fireproof pouring sealant for electronics does not produce pollution on a base material, and has excellent flame resistance, waterproof properties and dustproof properties. Through utilization of the special inorganic fire retardant, when a flame retardation grade reaches a level FV-0, storage properties of the additional organosilicon fireproof pouring sealant for electronics is improved, and deaeration properties and fluidity of the additional organosilicon fireproof pouring sealant for electronics are greatly improved in use. The component A and the component B compose the additional organosilicon fireproof pouring sealant for electronics, wherein the additional organosilicon fireproof pouring sealant for electronics does not produce pollution on a base material, and has stable flame resistance and storage properties and excellent operationality, and a high flame retardation grade reaching the level FV-0. Through the inorganic fire retardant which is adopted by the preparation method and is subjected to special treatment, an addition proportion, finished product storage stability and used product fluidity are effectively improved.

Description

Technical field [0001] The invention relates to an electronic potting glue and a preparation method thereof, in particular to an addition-type organic silicon fireproof electronic potting glue specially treated with an inorganic flame retardant and a preparation method thereof. Background technique [0002] With the advancement of science and technology, higher requirements have been placed on the packaging of electronic components. Due to the excellent aging resistance, physical inertness, electrical properties, waterproof and dustproof properties of addition-type organic silica gel, it can be vulcanized under normal temperature and pressure (heating can change the vulcanization speed), and it has been introduced into the Chinese market since the 1980s. After the rapid development, the products are widely used and the consumption has increased sharply. They are widely used in construction, automobile, electrical and electronic, machinery, chemical, food and other industries...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K9/06C08K3/22C08K3/04C08K5/5425C09K3/10
Inventor 张晓东
Owner SHANGHAI YOUNAI ORGANOSILICON MATERIAL
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