Diamond grinding wheel of elliptical working face and mutual wear forming and trimming method thereof

Abstract

The invention discloses a diamond grinding wheel of an elliptical working face and a mutual wear forming and trimming method thereof. The profile of an axial section of a working face of the diamond grinding wheel is an elliptical arc profile; an end face of the diamond grinding wheel is an elliptical face; in the method, a diamond grinding wheel tool travels from left to right to a top point of an elliptical arc at a first starting point outside one side of a silicon carbide grinding stone along an elliptical arc traveling path, is then lifted along a first circular arc tangential to the top point and with a radius of more than 2mm, next travels from right to left to the top point of the elliptical arc from a second starting point outside the other side of the grinding stone along the elliptical arc traveling path and is lifted along a second circular arc tangential to the top point and with a radius of more than 2 mm. Compared with the conventional circular face diamond grinding wheel, the elliptical face diamond grinding wheel has the advantages that: a flatter grinding wheel elliptical working face and a workpiece curved surface can be used for complexing to grind, the number of effective grinding particles is increased, and the surface quality and the shape accuracy of curved surface grinding are improved.

Description

technical field [0001] The invention relates to the technical field of micro-precision manufacturing of superhard tools, in particular to a diamond grinding wheel elliptical ring working surface and a method for grinding and shaping it. Surface CNC grinding technology. Background technique [0002] Systems such as laser scanning, optical fiber transmission, solar power generation, and lighting require optical interfaces. Among them, the curved surface of the optical interface is the core to ensure high-performance conversion between optoelectronics. However, parts and molding dies in the field of optoelectronics are usually hard and brittle materials such as silicon carbide ceramics, glass, and cemented carbide, which are difficult to process with traditional CNC milling technology. At present, it is difficult to guarantee the surface quality and shape accuracy at the same time in lapping and polishing technology, and only rely on high-cost and low-efficiency multiple compe...

AI Technical Summary

Problems solved by technology

However, parts and molding dies in the field of optoelectronics are usually hard and brittle materials such as silicon carbide ceramics, glass, and cemented carbide, which are difficult to process with traditional CNC milling technology.

At present, it is difficult to guarantee the surface quality and shape accuracy at the same time in lapping and polishing technology, and only rely on high-cost and low-efficiency multiple compensation processing methods

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