Composition with ceramic heat dissipation effects

A composition and beneficial technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problem that radiators cannot cope with heat dissipation work, etc.

Inactive Publication Date: 2012-02-08
SHAMROCK OPTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] And as the functions of these working and heating elements become more and more powerful, the heat generated by the work is also higher, making the existing matching heat sinks less and less able to cope with the heat dissipation work, and it is extremely necessary to develop heat sinks with stronger heat dissipation performance.

Method used

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  • Composition with ceramic heat dissipation effects
  • Composition with ceramic heat dissipation effects
  • Composition with ceramic heat dissipation effects

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Embodiment Construction

[0039] figure 2 It is a heat dissipation diagram of the composition of the present invention having the effect of ceramic heat dissipation. It can be seen from the figure that the composition 50 of the present invention has the effect of heat dissipation of ceramics. Composed of particles 60, 61, 62, especially the ceramic particles 60, 61, 62 are first treated with interface activation, so that when the ceramic particles 60, 61, 62 are in granular form, they can be fully bonded with the metal 70, except In addition to the good heat conduction ability H1 of the metal 70, the heat radiation ability H2 can also be enhanced by the encased ceramic particles 60, 61, 62, and the metal 70 is sintered into a metal solution in a granular form to cover and adhere to the ceramic particles 60 , 61, after refill molding, the whole surface in contact with the outside atmosphere will scatter a number of ceramic particle tops 60A, 61A protruding irregularly, increasing the fine convective he...

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Abstract

The invention discloses a composition with ceramic heat dissipation effects. The composition with ceramic heat dissipation effects comprises: by weight, 25 to 90% of ceramic particles which have particle sizes of 10 to 50 micrometers and heat conductivity lambda great than or equal to 25W/m*K and are subjected to interface activity treatment, and 75 to 10% of metal particles which have heat conductivity lambda great than or equal to 50W/m*K. The ceramic particles and the metal particles are heated to a temperature which is greater than a metal melting point and is less than a ceramic particle melting point in a non-oxidative environment, so that the metal particles are melted into molten metal and cover on the ceramic particles. The ceramic particles covered with the molten metal are subjected to perfusion molding in a non-oxidative environment. A product prepared from the composition with ceramic heat dissipation effects has good thermal conduction capabilities belonging to metals and good thermal radiation capabilities belonging to ceramics.

Description

technical field [0001] The invention relates to a composition with ceramic heat dissipation effect. Background technique [0002] Power-generating components, such as computer CPUs or high-illuminance LED circuit boards, etc., require a good heat sink to operate normally and maintain the service life of the product. Most of these power-generating components are stacked on the back and all Heat sinks made of metal, such as copper heat sinks, aluminum heat sinks, etc., use these metals to conduct and dissipate the heat of the heating element. [0003] And as the functions of these work-heating elements become more and more powerful, the heat-generating temperature of work is also higher, making the existing matching radiators more and more unable to cope with the heat dissipation work, and it is extremely necessary to develop radiators with stronger heat dissipation performance. [0004] In view of the above-mentioned various shortcomings in the way of strengthening the heat ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14B22F1/02
Inventor 萧俊庆张江忠
Owner SHAMROCK OPTRONICS
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