Film material processing device and vapor deposition equipment with same

A processing device and film material technology, applied in the field of evaporation equipment, can solve the problems of waste of processing time, non-dense internal structure, contamination of film material, etc., so as to avoid life and work efficiency, reduce waste of labor time, and improve evaporation efficiency. Effect

Inactive Publication Date: 2012-02-01
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the film material particles in the crucible are manually leveled, it is easily affected by the difference in particle size and the pores between particles, which makes the film material raw materials heated unevenly during subsequent melting, resulting in the surface of the final obtained film material. Unevenness, internal structure is not dense, etc.
In this regard, the existing technology is usually to artificially level the film material again. Therefore, the phenomenon of artificial contamination of the film material is easy to occur during the artificial leveling process, and the manual leveling needs to repeatedly break the vacuum and vacuumize the evaporation chamber. The operation will directly result in the waste of processing hours; in addition, frequent vacuum breaking and vacuuming will easily affect the life and working efficiency of the vacuum pump.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Film material processing device and vapor deposition equipment with same
  • Film material processing device and vapor deposition equipment with same
  • Film material processing device and vapor deposition equipment with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The technical solution will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0031] see figure 1 , the first embodiment of the present invention provides a film material processing device 100, which is used for flattening the evaporation film material, and the film material processing device 100 includes a crucible 10, a rotating shaft 20, a flattening cover 30, and a driver 40 .

[0032] The crucible 10 is used to hold film material raw materials and film materials (i.e. evaporation target material, not shown in the figure), and it has a housing hole 11 for containing film material raw materials or film materials, and the granular film material raw materials are placed in In the accommodating hole 11, the film material required for evaporation can be formed through vacuum heating. In this embodiment, the crucible 10 is a circular crucible, and the accommodating hole 11 is a circular hole. Certainly, the crucible 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a film material processing device which is used for leveling vapor deposition film material and comprises a crucible and a rotating shaft, wherein the crucible is provided with an accommodating hole for accommodating the film material; and the rotating shaft is connected with the crucible which can rotate around the rotating shaft. The film material processing device further comprises a leveling cover and a driver; the leveling cover and the accommodating hole of the crucible are matched for leveling the film material in the accommodating hole; the leveling cover is provided with a leveling surface of which the shape corresponds to the shape of the accommodating hole; the driver is provided with a driving shaft; the driving shaft and the leveling cover are matched; the driver is used for driving the leveling cover to rotate around the driving shaft so as to close or open the accommodating hole of the crucible; and when the accommodating hole is closed by the leveling cover, the leveling surface faces the bottom of the accommodating hole. The invention also provides vapor deposition equipment which is provided with the film material processing device.

Description

technical field [0001] The invention relates to a film material processing device, in particular to a film material processing device arranged in an ion-assisted evaporation system for flattening film material and evaporation equipment provided with the film material processing device. Background technique [0002] Optical thin films are generally deposited by Evaporation Deposition, Ion Assisted Evaporation (IAD) or Ion Beam Sputtering Deposition (IBSD). [0003] Ion-assisted evaporation has an independent ion source, which is easy to install and has low impact on the original system. The ion beam has a large range, uniform distribution, and good kinetic energy. It can easily compress the film layer and obtain a film with good adhesion. The film layer and other advantages have a high degree of adoption. In ion-assisted evaporation, the surface of the film material (that is, the evaporation target material) is required to be flat, the internal structure is dense, and it has...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24
Inventor 裴绍凯
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products