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Two-step mode two-temperature transient liquid-phase bonding method for dissimilar metals

An instantaneous liquid phase connection, dissimilar metal technology, applied in metal processing equipment, welding equipment, manufacturing tools, etc., can solve the problems of difficult to achieve TLP connection, differences in chemical and metallurgical properties, melting of low-melting base metals, etc., to promote joints. The effect of homogenizing ingredients, improving joining performance, preventing melting

Inactive Publication Date: 2012-01-04
CHONGQING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practical industrial applications, the connection between two dissimilar materials with significant differences in physical, chemical and metallurgical properties often occurs, and the melting point difference between some dissimilar metals is even as high as 300~700°C
In this case, when the conventional one-step TLP connection technology is used to connect such two dissimilar materials, due to the large difference in the properties of the weldment materials, especially the melting point, even though the weldment with a higher melting point can be welded when the welding temperature is high, but at the same time It will cause melting or burning loss of the low melting point base metal, and when the welding temperature is low, it will lead to the problem that it is difficult to realize the TLP connection between the higher melting point weldment and the interface of the intermediate layer
Therefore, there is nothing that can be done about the connection between two dissimilar materials with significant differences at present, only the connection between two dissimilar materials with small differences

Method used

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  • Two-step mode two-temperature transient liquid-phase bonding method for dissimilar metals
  • Two-step mode two-temperature transient liquid-phase bonding method for dissimilar metals

Examples

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example 1

[0033] Example 1: 5083 aluminum alloy and TC4 titanium alloy with a diameter of 16mm were welded using a two-step dual-temperature transient liquid phase (TLP) connection method, with a copper foil with a thickness of 150 μm as the intermediate layer. The process parameters are: the first TLP connection: the temperature is 885-900°C, the external load is 0.2MPa, and the time is 3 minutes; the second TLP connection: the temperature is 555°C, the external load is 0.2MPa, and the time is 5 minutes. The results of microscopic analysis showed that effective connection was achieved.

example 2

[0034] Example 2: AZ31B magnesium alloy and 5083 aluminum alloy with a diameter of 16mm were welded using a two-step dual-temperature transient liquid phase (TLP) connection method with a copper foil with a thickness of 150 μm as the intermediate layer. The process parameters are: the first TLP connection: the temperature is 555-570°C, the external load is 0.2MPa, and the time is 2 minutes; the second TLP connection: the temperature is 495°C, the external load is 0.2MPa, and the time is 10 minutes. The results of microscopic analysis showed that effective connection was achieved.

example 3

[0035]Example 3: AZ31B magnesium alloy and TC4 titanium alloy with a diameter of 16mm were welded using a two-step dual-temperature transient liquid phase (TLP) joining method with a copper foil with a thickness of 150 μm as the intermediate layer. The process parameters are: the first TLP connection: the temperature is 885-900°C, the external load is 0.2MPa, and the time is 3 minutes; the second TLP connection: the temperature is 495°C, the external load is 0.2MPa, and the time is 10 minutes. The results of microscopic analysis showed that effective connection was achieved.

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Abstract

The invention discloses a two-step mode two-temperature transient liquid-phase bonding method for dissimilar metals, wherein the eutectic temperature between an intermediate layer and high-melting point parent metal is 100-400 DEG C higher than that between the intermediate layer and low-melting point parent metal. The method comprises the following steps of: (1) welding one end of the intermediate layer to the high-melting point parent metal at the temperature T1 by using a transient liquid phase bonding method; and (2) welding the other end of the intermediate layer to the low-melting pointparent metal at the temperature T2, wherein the temperature T2 is lower than the melting temperature of the low-melting point parent metal. The two-step mode two-temperature transient liquid-phase bonding method for the dissimilar metals disclosed by the invention can be used for bonding between the dissimilar metals with significant difference for physical, chemical and metallurgical properties,in particular for bonding between the dissimilar metals with a melting point difference value of 300-700 DEG C, the bonding and the sufficient diffusion between the high-melting point parent metal and the intermediate layer are ensured to be realized, and meanwhile, the occurrence of melting and burning loss of the parent metal with a lower melting point in a welding process can be prevented, so that the effective bonding between dissimilar metal weldments is realized.

Description

technical field [0001] The invention relates to a connection method between two metals, specifically a two-step dual-temperature transient liquid phase (TLP) connection method for connection between dissimilar metals. The connection between dissimilar materials, especially solves the connection problem between dissimilar metals with a melting point difference of 300~700°C. [0002] Background technique [0003] Transient liquid phase (TLP) diffusion bonding is a welding method developed on the basis of the diffusion welding process. Compared with conventional diffusion welding, TLP connection has lower requirements for surface preparation of the workpiece to be welded, shorter welding time, and joint quality. and high stability. Usually, TLP connection refers to the addition of an intermediate layer alloy between the surfaces of the welded metals, relying on the melting of the intermediate layer alloy during the welding process or the eutectic reaction with the base metal ...

Claims

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Application Information

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IPC IPC(8): B23K28/00
Inventor 盛光敏袁新建赵国际刘蒙恩罗军吴莉莉
Owner CHONGQING UNIV
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