Multifunctional laminated electronic diaphragm and production method thereof

Abstract

The invention relates to a multifunctional laminated electronic diaphragm, which comprises a base layer, an insulated colorful dope layer, a metal diaphragm layer, a conductive glue diaphragm layer and a protective diaphragm layer which are sequentially laminated. The production method of the multifunctional laminated electronic diaphragm comprises the following steps that: 1) polyethylene terephthalate (PET) is used for producing a substrate, and corona pretreatment is undertaken on the surface of the substrate; 2) the insulated colorful dope is coated on the substrate; 3) the metal diaphragm layer is formed in a physical vapor deposition (PVD) method; 4) the conductive glue diaphragm layer is formed on the metal diaphragm layer; and 5) the protective diaphragm layer is attached onto theconductive glue diaphragm layer. The laminated electronic diaphragm is provided with the colorful base diaphragm layer, so the laminated electronic diaphragm is convenient to identify; the metal diaphragm layer which is generated in the PVD method and the insulated colorful dope layer have high stripping strength, so the laminated electronic diaphragm can bear the heat and can be used in a lamination technique and connection of soft plates and soft-hard combined plates; and at the same time the laminated electronic diaphragm can realize the shielding function and the soft connection function.Moreover, the cost is low, the bending performance is excellent, and the laminated electronic diaphragm is easy to process.

Description

technical field [0001] The invention relates to an electronic film with multiple functions such as color identification, shielding and soft connection for printed circuit boards. The present invention also relates to a manufacturing method of the above-mentioned electronic film. Background technique [0002] Printed circuit boards and flexible circuit boards are the basic carriers of electronic products, and their functional requirements are getting more and more attention from the industry. More functional, simplified, and thinner requirements are put forward for the materials used for circuit boards. [0003] Color recognition function: Since the colors of many materials in the process of circuit board processing are very close, the identifiability of the materials is poor, and it is easy to cause confusion in material processing; in order to identify the workpiece, the surface of the workpiece is often coated with colored paint. Difficult and very inconvenient, and coati...

AI Technical Summary

Problems solved by technology

[0003] Color recognition function: Since the colors of many materials in the process of circuit board processing are very close, the identifiability of the materials is poor, and it is easy to cause confusion in material processing; in order to identify the workpiece, the surface of the workpiece is often coated with colored paint. Difficult and very inconvenient, at the same time the paint will cause environmental pollution and be harmful to human health

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