Plasma processing apparatus, substrate holding mechanism, and method for substrate position deviation detection

Abstract

PROBLEM TO BE SOLVED: To enhance detection precision of a position shift of a substrate by eliminating an effect of pressure loss in a gas passage for heat transfer gas.SOLUTION: There are provided a gas passage 352 for supplying gas from a gas supply source therethrough to the gap between a mount table 300 and a processing target substrate held on a substrate holding surface of the mount table 300, plural gas holes 354 formed in the substrate holding surface of the mount table to guide the gas from the gas passage onto a substrate holding surface Ls, plural pressure detecting holes 370a to 370b formed at the outside of a gas hole forming area R in the substrate holding surface to detect a pressure applied to the back surface of the substrate, and pressure sensors 380a to 380d connected to the pressure detecting holes. A position shift of the substrate is detected on the basis of the detected pressure from the pressure sensors.

Description

technical field [0001] The present invention relates to a plasma processing apparatus, a substrate holding mechanism, and a method for detecting a positional deviation of a substrate for performing plasma processing on a large substrate such as a glass substrate for a flat panel display (FPD). Background technique [0002] In FPD panel manufacturing, pixel designs, electrodes, wiring, etc. are generally formed on a substrate made of an insulator such as glass. Among various processes of such panel production, microprocessing such as etching, CVD, ashing, and sputtering is performed by a plasma processing apparatus. In a plasma processing apparatus, for example, a substrate is placed on a stage having a susceptor constituting a lower electrode in a decompressible processing chamber, and high-frequency power is supplied to the susceptor to form plasma of a processing gas on the substrate. This plasma performs predetermined processing such as etching on the substrate. [0003...

AI Technical Summary

Problems solved by technology

In this method, for example, when there is no semiconductor wafer or the electrostatic holding force is small, the pressure measurement gas leaks from the pressure measurement hole and the pressure drops. Therefore, by monitoring the pressure, it is possible to detect the presence of the semiconductor wafer on the mounting table. None and hold state, but cannot detect the positional deviation of the semiconductor wafer

The technique described in Patent Document 2 also provides a pressure measurement hole on the upper part of the mounting table to detect pressure, but it cannot detect positional displacement similarly to the above.

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