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LED surface light source and manufacturing method thereof

A technology of LED surface light source and LED chip, which is applied in the light source, electric light source, point light source, etc., can solve the problems of large stress on the substrate chip, shortened life of the LED chip, and local temperature rise, so as to reduce the probability of failure. , The effect of reducing welding points and high processing efficiency

Active Publication Date: 2011-12-21
陈炜旻
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0003] During the use of the LED light source, the heat released by the LED chip will cause the local temperature to rise. Although the released heat will be released by the heat sink on the back of the LED substrate, the shortened life of the LED chip and thermal expansion caused by the temperature rise are still problems for LEDs. The key issues that need to be solved in packaging, for example, in the environment of large temperature difference, the thermal expansion of the substrate causes a lot of stress in the working state of the chip. When the power LED chip is used, it may even cause the chip to break and the wires on the solder joint to be desoldered, which is also a key factor that restricts the further thinning and enlargement of the LED chip.

Method used

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  • LED surface light source and manufacturing method thereof
  • LED surface light source and manufacturing method thereof
  • LED surface light source and manufacturing method thereof

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Embodiment Construction

[0032] Such as Figure 1 to Figure 3 As shown, Embodiment 1 of the present invention is an LED surface light source. The surface light source includes a first power supply external lead electrode 1 and a second power supply external lead electrode 6 for supplying power to the entire light source, LED chips 2 of strip-shaped cloth, strips The chip connecting wire 3 of the strip-shaped cloth sheet, the LED chip positive electrode pad 4 of the strip-shaped cloth sheet, the LED chip negative electrode pad 5 of the strip-shaped cloth sheet, the positive electrode pad 4 and the negative electrode pad 5 of the adjacent chip 2 are connected by the connecting wire 3 connected together to form a connected circuit. another example figure 2 As shown, the spherical rubber block 8 in the first adhesive layer covers the single chip 2 and the positive and negative electrode pads; the segmented spherical rubber block 8 is covered with a continuous colloid lens layer 9, that is, the second ...

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Abstract

The invention discloses an LED surface light source, which comprises a substrate and a plurality of LED chips installed on the substrate. It is composed of two discontinuous glue blocks, each piece of glue is covered with more than one LED chip, and there is an encapsulation layer that continuously covers the first glue layer outside the first glue layer. The LED surface light source has the advantage of long service life.

Description

technical field [0001] The invention relates to an LED lighting fixture and a manufacturing method thereof, in particular to an LED surface light source in which the LED is used as a luminous body and a manufacturing method thereof. Background technique [0002] As a light source for lighting appliances, the internal light-emitting part of the existing COB-packaged LED surface light source is composed of a plurality of interconnected LED chips. The way to install LED chips is usually to install the LED chips on the substrate first, and then coat the adhesive layer on the substrate and the LED chips. [0003] During the use of the LED light source, the heat released by the LED chip will cause the local temperature to rise. Although the released heat will be released by the heat sink on the back of the LED substrate, the shortened life of the LED chip and thermal expansion caused by the temperature rise are still problems for LEDs. The key issues that need to be solved in pac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/54H01L33/58F21S2/00F21Y101/02
Inventor 陈炜旻
Owner 陈炜旻
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