Device for scraping and cutting on semiconductor device chip glass passive film and using method thereof

Abstract

The invention discloses a device for scraping and cutting on a semiconductor device chip glass passive film. The device is characterized by comprising a laser, a light path transmission channel, a beam-expanding device, a deflection device, an optical focusing device, an air blowing and exhausting device, a glass passive film and an operating platform, wherein the laser is connected with the light path transmission channel; the optical focusing device is arranged on two sides of a purple light laser beam; and the air blowing and exhausting device is arranged on one side of the purple light laser beam. The invention also discloses a using method of the scraping and cutting device. The using method comprises the following steps of: adjusting the temperature value of a crystal; adjusting a horizontal polarizer of the light path transmission channel; adjusting and fixing the position of the beam-expanding device; adjusting the deflection device; arranging and adjusting the optical focusing device; adjusting and testing the horizontal angle of the operating platform; adjusting the working Q frequency and electric frequency pulse width of the laser; selecting proper current and scraping and cutting speed; and inspecting products. The device and the using method thereof have the advantages of high scraping and cutting speed, low consumption cost, low maintenance cost, high productivity and high silicon wafer area utilization ratio.

Description

technical field [0001] The invention relates to a method for using a device for scribing on a semiconductor device chip glass passivation film. Background technique [0002] In the semiconductor device chip scribing process, the method of scribing with a grinding wheel blade in the slicing area on the silicon material between the chip and the chip is generally used: the silicon chip to be diced is attached to the blue film, and the high-speed rotating The grinding wheel blade cuts the silicon wafer in the vertical and horizontal directions, and then stretches the blue film to separate the semiconductor device chips from each other, which is convenient for the subsequent packaging of the finished product. [0003] There are following deficiencies in the method of grinding wheel scribing: [0004] 1. Grinding wheel scribing is a contact scribing method. During the scribing process, the silicon wafer is easily subjected to mechanical punching force, and the silicon wafer is ea...

AI Technical Summary

Problems solved by technology

[0004]1. Grinding wheel scribing belongs to the contact scribing method. During the scribing process, the silicon wafer is easily subjected to mechanical stamping force, and the silicon wafer is easily deformed and displaced, resulting in semiconductor Chips are scrapped due to broken edges and deflected scratches

[0005]2. The speed of the grinding wheel blade is very slow when cutting the glass passivation film of the semiconductor device chip (generally around ≤8mm / s), and the production efficiency is extremely low. After that, there are many cracks, and the surface of the device chip contains dust attached, which seriously affects the product characteristics

[0006]3. Grinding wheel scribing requires more consumable auxiliary materials, such as: a large amount of deionized water, grinding wheel blades, trimming blades, auxiliary tools, etc., required maintenance costs, High labor cost

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