Measuring device and method for measuring coefficient of metal linear expansion by Doppler vibration lens sine modulation multi-beam laser heterodyning secondary harmonics
A Doppler galvanometer and sinusoidal modulation technology, applied in measurement devices, optical devices, thermal expansion coefficients of materials, etc., can solve the problems of poor laser signal quality and signal processing operation speed, and achieve simple structure and high precision. high effect
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specific Embodiment approach 1
[0019] Specific implementation mode one: combine figure 1 Describe the present embodiment, the measuring device of the Doppler vibrating mirror sinusoidal modulation multi-beam laser heterodyne second harmonic measurement metal linear expansion coefficient described in the present embodiment, it comprises H0 solid-state laser 2, quarter-wave plate 12, Galvanometer 13, first plane mirror 3, polarizing beam splitter PBS11, converging lens 10, thin glass plate 9, second plane mirror 6, metal rod 15 to be tested, electric furnace 14, photodetector 4 and signal processing System 5;
[0020] The linearly polarized light emitted by the H0 solid-state laser 2 is reflected by the first plane reflector 3 and then enters the polarizing beam splitter PBS11, and the light beam reflected by the polarizing beam splitting mirror PBS11 is transmitted by the quarter-wave plate 12 and then enters the vibrating beam. The light receiving surface of the mirror 13, the light beam reflected by the o...
specific Embodiment approach 2
[0022] Specific embodiment two: the difference between this embodiment and specific embodiment one is that it also increases the temperature controller 16 and the temperature acquisition device, the temperature control signal input end of the electric furnace 14 and the temperature control of the digital display temperature controller 16 The signal output end is connected; the temperature acquisition device collects the temperature of the metal rod 15 to be measured, and the temperature signal output end of the temperature acquisition device is connected with the temperature signal input end of the temperature controller 16 . Other compositions and connection methods are the same as those in Embodiment 1.
specific Embodiment approach 3
[0023] Embodiment 3: The difference between this embodiment and Embodiment 2 is that the temperature controller 16 is a digital display temperature controller. Other compositions and connection methods are the same as those in the second embodiment.
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