Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-temperature pressure and temperature compounded sensor and preparation method thereof

A composite sensor, high temperature technology, used in thermometers, measurement of the property force of piezoresistive materials, thermometers with directly sensitive electrical/magnetic components, etc., to achieve high vibration resistance, low specific gravity, and manufacturing costs. low effect

Active Publication Date: 2013-01-02
SHENYANG SENSOR TECH INST
View PDF5 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a composite sensor of high temperature pressure and temperature and its preparation method, which solves the problem of high reliability in the prior art that cannot meet the requirements of measuring pressure and temperature at the same point, and not only retains the existing silicon sapphire force sensor Compared with similar products, it has the characteristics of more reasonable manufacturing process, quick operation, relatively low cost and high production efficiency, which significantly improves the high reliability of measurement under harsh conditions

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-temperature pressure and temperature compounded sensor and preparation method thereof
  • High-temperature pressure and temperature compounded sensor and preparation method thereof
  • High-temperature pressure and temperature compounded sensor and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] according to Figure 1-7 The specific structure and preparation method of the present invention will be described in detail. The composite sensor of high temperature pressure and temperature includes sapphire wafer 2 and titanium alloy stress cup 1, platinum pad 4, insulated lead conversion plate 8, titanium fixing claw 9, outer lead 7 and Titanium alloy casing 11 and other parts. Among them, the center of the symmetry axis of the titanium alloy stress cup 1 (the inner diameter of the stress cup) is positioned, and a platinum thermistor 15 is provided in the corner of the non-stress area on the same sapphire wafer 2 on which the silicon strain resistance 3 and the platinum pad 4 are made in the stress area. . The inner cavity of the titanium fixing claw 9 welded on the titanium alloy stress cup 1 is sealed with an insulated lead conversion plate 8 by means of a silver brazing layer 10 . One end of the metal foil strip 5 used as the inner lead is welded on the pla...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Mohs hardnessaaaaaaaaaa
Login to View More

Abstract

The invention provides a high-temperature pressure and temperature compounded sensor and a preparation method thereof. The invention improves the structure of the previous patent of the inventor: silicon sapphire force sensor and the preparation method thereof. The manufacturing method comprises the following steps of manufacturing a platinum thermal resistor having same materials with a strain resistance leading-through platinum welding disc and a platinum welding disc of an internal leading-through at one corner of a non-stress area on a same sapphire wafer with a silicon strain resistor; adopting a welding metal foil strip to replace the original elastic metal contact or the internal leading-through in other forms, thus preparing the high-temperature pressure and temperature compoundedsensor with strong vibration resistance and large acceleration resistance. The method solves the problem that the high reliability can not be met when the pressure and the temperature are measured ata same point in the prior art. The high-temperature pressure and temperature compounded sensor remains the advantages of the existing silicon sapphire force sensor; furthermore, compared with the similar product, the high-temperature pressure and temperature compounded sensor has the advantages of more reasonable manufacturing technology, quick operation, low relative cost, high production efficiency and the like, and obviously improves the high reliability of the measurement under the severe conditions.

Description

technical field [0001] The invention relates to a sensor for measuring pressure and temperature and its preparation method, in particular to a high-temperature sensor that can be measured at the same point at the same time under the environmental conditions of a large acceleration of 40 g or more and a high temperature of 400 ° C or higher for a measured medium such as liquid or gas. Composite sensor for pressure and temperature and its preparation method. Background technique [0002] Scientific and technological workers know that the same point measurement of the pressure and temperature of the measured medium such as liquid or gas, in special measurement environments such as spacecraft, aircraft, high-speed trains, rockets (missiles), nuclear reactors, etc., the measurement reliability requirements are very high. important and necessary. However, the existing sensors are far from meeting the requirements of measurement reliability not only in terms of manufacturing accur...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/18G01K7/22
Inventor 段磊段祥照
Owner SHENYANG SENSOR TECH INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products