Integrated illuminating part and preparation method thereof

A technology of luminous parts and curing agents, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of reduced luminous efficiency, inconsistent color temperature, thickness sensitivity, etc., and achieve the effects of reduced reflection and scattering, stable quality, and easy operation

Inactive Publication Date: 2011-10-05
OCEANS KING LIGHTING SCI&TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this preparation method, since the luminescent plate has a certain thickness and the phosphor particles are evenly dispersed therein, the yellow light generated by the blue light excited by the phosphor will encounter the phosphor particles again and be reflected and scattered, which will lead to a decrease in the luminous efficiency. At the same time, the color temperature of white LEDs is very sensitive to the thickness of the light-emitting plate. In different batches or the same batch of LED packages, small differences in the thickness of the light-emitting plate will lead to inconsistent color temperatures of the packaged LEDs.

Method used

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  • Integrated illuminating part and preparation method thereof

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Embodiment 1

[0025] Embodiment 1, as figure 1 As shown, an integrated light-emitting element includes a transparent substrate 3, a layer of phosphor layer 2 is arranged on the substrate 3, and the phosphor layer 2 is covered with a curing agent for curing the phosphor layer 2 on the substrate. Layer 1. The integrated light-emitting element in this embodiment is an integrated light-emitting panel. The substrate 3 is a glass plate, and the thickness of the substrate 3 is 0.5mm. The phosphor layer 2 is a YAG:Ce phosphor layer, and the thickness of the phosphor layer 2 is 40 μm. The curing agent is water glass. The substrate 3 is made of a hard material with a light-transmitting wavelength of 300nm-750nm, and can be a flat plate or other shapes, as long as it matches the shape of the LED.

[0026] The preparation method of the integrated light-emitting element is to adopt the following steps:

[0027] (1) Coating a layer of fluorescent powder on the prepared substrate;

[0028] (2) coati...

Embodiment 2

[0036] Embodiment 2, an integrated light-emitting element, including a transparent substrate 3, a layer of phosphor layer 2 is arranged on the substrate 3, and the phosphor layer 2 is covered with a curing agent for curing the phosphor layer 2 on the substrate. agent layer 1. The substrate 3 in this embodiment is an epoxy resin board, and the thickness of the substrate 3 is 1 mm. The phosphor layer 2 is a mixture layer of yellow phosphor YAG:Ce and red phosphor CaS:Eu, and the thickness of the phosphor layer 2 is 30 μm. The curing agent is epoxy resin.

[0037] The preparation method of the integrated light-emitting element in this embodiment is the same as that in Embodiment 1, and will not be repeated here. The difference is that the coating method of the phosphor powder used is the sedimentation method, which is a prior art, and will not be described in detail here. Firstly, a phosphor layer with a thickness of 30 μm was prepared on the prepared epoxy resin plate by the ...

Embodiment 3

[0038] Embodiment 3, as figure 1 As shown, an integrated light-emitting element includes a transparent substrate 3, a layer of phosphor layer 2 is arranged on the substrate 3, and the phosphor layer 2 is covered with a curing agent layer for curing the phosphor layer 2 on the substrate. 1. The substrate 3 in this embodiment is a silica gel plate. The phosphor layer 2 is a yellow silicate phosphor layer (the yellow silicate phosphor is provided by Dalian Luming Lighting Technology Co., Ltd., the product model is LMS-560-B), and the thickness of the phosphor layer 2 is 20 μm. The curing agent is silica gel.

[0039] The preparation method of the integrated light-emitting element in this embodiment is the same as that in Embodiment 1, and will not be described again. The difference is that the phosphor powder used is sprayed, and the spraying method is a prior art, so it will not be described in detail here. . Firstly, a layer of yellow silicate phosphor powder with a thickne...

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Abstract

The invention discloses an integrated illuminating part and a preparation method thereof. The integrated illuminating part comprises a transparent substrate on which a layer of phosphor is provided. A curing agent layer solidifying the phosphor layer on the substrate is covered outside the phosphor layer. The preparation method is firstly coating a layer of phosphor on the substrate, then coating a layer of curing agent on the phosphor layer and lastly heating and curing the substrate to make the integrated illuminating part. According to the integrated illuminating part provided in the invention, the scattering and reflection of phosphor particles towards light are effectively reduced, the luminescence efficiency is high and the thickness difference of illuminating parts does not influence the white light LED color temperature. The preparation method is characterized by simple process and easy operation and the integrated illuminating part prepared has a high luminescence efficiency.

Description

technical field [0001] The invention belongs to the technical field of luminescent materials, and relates to a luminescent material and a preparation method thereof, in particular to an integrated luminous element and a preparation method thereof. Background technique [0002] LED (Light Emitting Diode, Light Emitting Diode) has shown huge market potential and application prospect in solid-state lighting because of its long service life, high efficiency, energy saving, green environmental protection and other advantages. The currently used LED packaging structure is to fix the blue LED chip in the bracket, and coat a layer of yellow phosphor on the blue LED chip, and then fill the outer layer with potting glue. The blue light emitted by the chip excites the phosphor to emit yellow light, and the blue light and yellow light mix to form white light. For integrated high-power LEDs, the surface temperature of the chip is very high, and in the above packaging method, the phospho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50
Inventor 周明杰马文波罗茜翁方轶
Owner OCEANS KING LIGHTING SCI&TECH CO LTD
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