Dry film conveying mechanism of wafer film pressing machine

Abstract

The invention relates to a dry film conveying mechanism of a wafer film pressing machine, comprising a base, a discharging device and a dry film flattening device. The base is provided with a working platform on which a dry film is unfolded to facilitate the cutting operation, two ends of the base are respectively provided with one film unfolding roller for unfolding the dry film to facilitate the dry film in a flat state above the working platform; another two sides of the base are respectively provided with one guide rail for settingthe dry film flattening device to facilitate the movement between the two film unfolding rollers on the working platform; the discharging device comprises a discharging roller and a furling roller for outputing the dry film to the working platform to facilitate the film unfolding roller to unfold the dry film, the discharging roller is used for rolling the dry film which is not been cut and the furling roller is used for furling a cut dry film residual material. The dry film flattening device is used for grip the dry film to facilitate that the discharge device rolls the material and moves together with the dry film to keep the dry film flatness.

Description

technical field [0001] The present invention relates to a dry film conveying mechanism of a wafer laminator, in particular to a dry film conveying mechanism which has a leveling function and allows the dry film to be cut in a relatively flat state, so as to improve the yield rate of the dry film cutting operation. Dry film delivery mechanism. Background technique [0002] In the past, the wafer dicing device used a rectangular film material, and attached the film material to the wafer, and then removed the excess part with a knife die. In order to avoid contact between the knife and the wafer, the cut film material must be larger than Wafer area, but in accordance with the wafer manufacturing process, it is necessary to reserve a circle around the wafer without film material attached; [0003] Please refer to China Taiwan Patent Application No. 096202954 "wafer film cutting machine", which is set on a horizontal base body and includes: a frame body, which is located on the ...

AI Technical Summary

Problems solved by technology

[0009] This shows that above-mentioned prior art obviously still has inconvenience and defect in structure and use, and urgently needs to be further improved

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. Urgent problem

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