Method for improving weak light response of amorphous silicon film battery
An amorphous silicon thin film and battery technology, applied in the direction of circuits, electrical components, sustainable manufacturing/processing, etc., can solve the problems of interface defect density, stress concentration, etc., achieve weak light response improvement, eliminate heterojunction, and eliminate stress Effects of Concentration and Defect Density
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Embodiment 1
[0039] (1) Cleaning the transparent conductive oxide (TCO) substrate;
[0040] (2) On the TCO substrate, use plasma-enhanced chemical vapor deposition equipment to deposit an amorphous silicon film. Wherein the P layer deposition parameters are as follows:
[0041] Deposit the P-type layer on the transparent conductive glass, the deposition process parameters of the P layer are: SiH 4 、H 2 、CH 4 , TMB (trimethylboron or diethylalkane) gas, the deposition temperature is 180-260°C, and the deposition power density is 0.006-0.03W / cm 2 , the deposition pressure is 60-300Pa, CH 4 : SiH 4 The gas flow ratio is 40-70:100, and the deposition thickness is 10-20nm.
[0042] I layer through SiH 4 、H 2 、CH 4 gas, the deposition temperature is 180-260°C, H 2 : SiH 4 The dilution ratio is 2-20:1, and the deposition power density is 0.006-0.03W / cm 2 , the deposition pressure is 60-150Pa, CH 4 : SiH 4 The gas flow ratio is 7-10:100, and the deposition thickness is 150-500nm.
...
Embodiment 2
[0047] (1) Cleaning the transparent conductive oxide (TCO) substrate;
[0048] (2) On the TCO substrate, use plasma-enhanced chemical vapor deposition equipment to deposit an amorphous silicon film. Wherein the P layer deposition parameters are as follows:
[0049] Deposit the P-type layer on the transparent conductive glass, the deposition process parameters of the P layer are: SiH 4 、H 2 、CH 4 , TMB (trimethylboron or diethylalkane) gas, the deposition temperature is 180-260°C, and the deposition power density is 0.006-0.03W / cm 2 , the deposition pressure is 60-300Pa, CH 4 : SiH 4 The gas flow ratio is 40-70:100, and the deposition thickness is 10-20nm.
[0050] I layer through SiH 4 、H 2 、CH 4 gas, the deposition temperature is 180-260°C, H 2 : SiH 4 The dilution ratio is 2-20:1, and the deposition power density is 0.006-0.03W / cm 2 , the deposition pressure is 60-150Pa, CH 4 : SiH 4 The gas flow ratio is 13-20:100, and the deposition thickness is 150-500nm.
...
Embodiment 3
[0055] (1) Cleaning the transparent conductive oxide (TCO) substrate;
[0056] (2) On the TCO substrate, use plasma-enhanced chemical vapor deposition equipment to deposit an amorphous silicon film. Wherein the P layer deposition parameters are as follows:
[0057] Deposit the P-type layer on the transparent conductive glass, the deposition process parameters of the P layer are: SiH 4 、H 2 、CH 4 , TMB (trimethylboron or diethylalkane) gas, the deposition temperature is 180-260°C, and the deposition power density is 0.006-0.03W / cm 2 , the deposition pressure is 60-300Pa, CH 4 : SiH 4 The gas flow ratio is 40-70:100, and the deposition thickness is 10-20nm.
[0058] I layer through SiH 4 、H 2 、CH 4 gas, the deposition temperature is 180-260°C, H 2 : SiH 4 The dilution ratio is 2-20:1, and the deposition power density is 0.006-0.03W / cm 2 , the deposition pressure is 60-150Pa, CH 4 : SiH 4 The gas flow ratio is 23-33:100, and the deposition thickness is 150-500nm.
...
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