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Highly transparent electronic encapsulating adhesive

A potting glue and electronic technology, applied in other chemical processes, chemical instruments and methods, etc., can solve the problems of low light transmittance, high production cost, and unfavorable mass promotion and use, so as to reduce production cost and improve utilization rate Effect

Inactive Publication Date: 2011-09-07
深圳市固加实业发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing domestic technology has the defect of low light transmittance, which can only reach 92%, and cannot effectively refract the light from the light-emitting components on the potting cover, so that the loss of light energy when passing through the silica gel is too large, reaching 8%.
Moreover, the traditional and expensive fumed silica technology has high production costs, which is not conducive to mass promotion and use.

Method used

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Embodiment Construction

[0021] refer to figure 1 , the present invention is implemented like this:

[0022] exist figure 1 Among them, a highly transparent electronic potting compound is made by the following production steps:

[0023] 1), the basic polymer is made through the synthesis process of hydroxyl-terminated polydimethylsiloxane;

[0024] 2), the surface treatment process of reinforcing filler;

[0025] 3), the semi-finished rubber compound is made by the banburying process;

[0026] 4) Highly transparent electronic potting and sealing products are made by the glue compounding process.

[0027] The synthesis process of the polydimethylsiloxane terminated by the hydroxyl group is firstly in a special reaction kettle, drop into 98% content of D4 (octamethyltetrasiloxane ring body) or DMC (dimethylsiloxane alkane mixed ring body), then heat up to 60-65°C to remove water in a vacuum, then add various additives (including initiators, hydroxyl capping agents, etc.) Filtration becomes hydroxy...

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Abstract

The invention relates to the field of silica gels, in particular to a highly transparent electronic encapsulating adhesive with high light transmittance and low production cost. The adhesive is prepared by the following production steps of: 1) preparing hydroxyl-terminated polydimethylsiloxane, namely base polymer; 2) performing surface treatment on a reinforcing filler; 3) performing internal mixing to prepare a semi-finished adhesive; and 4) preparing a finished highly transparent electronic encapsulating adhesive. The invention has the advantages that: a production formula and a process are technically innovated, the conventional expensive fumed silica is discarded, precipitated silica is adopted and is subjected to surface modification by a composite treating agent (silazane, methoxysilane, hydroxyl silicone oil, water and the like) after being subjected to nano-scale dispersion so as to form an 820# electronic encapsulating adhesive with the light transmittance of 96 percent, and the light transmittance is 4 percent higher than that of the product prepared by the conventional process, namely the light energy utilization rate of components on an encapsulating surface is improved by 4 percent; and the light utilization rate is improved, namely the production cost of a part is reduced, and an obvious progress is made.

Description

technical field [0001] The invention relates to the field of silica gel, in particular to a highly transparent electronic potting glue with high light transmittance and low production cost. Background technique [0002] Silica gel (Silicone rubber) alias: silicone rubber, can be divided into two categories according to its properties and components: organic silica gel and inorganic silica gel; according to the vulcanization type and vulcanization mechanism can be divided into three categories: two-component condensation type room temperature vulcanized silicon Rubber, two-component addition type room temperature vulcanized silicone rubber, high temperature vulcanized silicone rubber. Silica gel is insoluble in water and any solvent, non-toxic, tasteless, stable in chemical properties, and does not react with any substance except strong alkali and hydrofluoric acid. Various types of silica gel form different microporous structures due to their different manufacturing methods...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/06C08K9/06C08K3/36C09K3/10C08G77/16
Inventor 许少汕
Owner 深圳市固加实业发展有限公司
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