Cubic boron nitride cutting line

Abstract

The invention discloses a cubic boron nitride cutting line. Cubic boron nitride is compositely and electrically deposited on the surface of a metal blank wire; the grain diameter of the cubic boron nitride is 10-75Mu m; and the diameter of the metal blank wire is 0.1-1.5mm. The preparation method of the cubic boron nitride cutting line is as follows: the metal blank wire is deoiled and derusted; and the cubic boron nitride and metal nickel are compositely and electrically deposited, and then are cleaned and dried. The cubic boron nitride cutting line has excellent high temperature oxidation resistance and a low friction coefficient, long service life, a low cost, smooth cutting and processing surfaces, high smoothness, and low surface material crystal structure damage. The cutting capacity of the cubic boron nitride cutting line is almost same with that of an electrodeposition diamond wire. The cubic boron nitride cutting line is suitable for extracting and cutting large-size silicon ingots at high speed, and cutting high-quality silicon wafers.

Description

technical field [0001] The invention relates to a cubic boron nitride cutting wire, in particular to a cutting wire for silicon, sapphire, marble, magnetic Cubic boron nitride wire for cutting hard and brittle materials such as metal materials. It belongs to the field of cutting and processing consumables for hard and brittle materials. Background technique [0002] Hard and brittle materials include various stones, gemstones, glass, silicon crystals, piezoelectric crystals, hard alloys, ceramics, rare earth magnetic materials, etc. Hard and brittle materials are mostly non-conductors or semiconductors, usually with high hardness, high brittleness, high wear resistance, high corrosion resistance, high resistivity, high temperature resistance, and non-magnetic conductivity. The promotion and application of hard and brittle materials put forward high requirements for their processing technology. Cutting is a key process in the processing of hard and brittle materials. Its m...

AI Technical Summary

Problems solved by technology

There is a prominent problem when using electroplated diamond wire cutting: due to the narrow slit, it is difficult for the coolant to enter the incision to achieve effective cooling, resulting in rapid oxidation of diamond particles at high temperatures generated by high-speed grinding and cutting, the hardness of diamond decreases, and rapid wear causes electroplated diamond wire short service life

This problem is especially prominent when it is used for square cutting of large-size silicon ingots

Images