Laser scribing method and device

A laser scribing and laser technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve problems such as unfavorable cost and complicated equipment

Active Publication Date: 2011-08-03
SEISHIN TRADING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In this method, since it is necessary to control and irradiate the laser beam to the portion where

Method used

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  • Laser scribing method and device
  • Laser scribing method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0075] In the case of forming a scribed groove on a workpiece using a laser scribing device that splits the laser light emitted from a laser source to form multiple beam spots, the relationship between the out-of-focus position and the depth of the groove was studied. .

[0076] The laser scribing device is used figure 2 In the shown laser scribing device, the components of the 1 / 4 wavelength plate are omitted.

[0077] As a laser source, Nd:YAG laser (wavelength 1064nm, output 10W) ​​was used. The output characteristics of the laser light were set as shown in Table 1.

[0078] For the birefringent element, a crystal plate with a wedge angle of 2° is used.

[0079] As the condenser lens, a lens with a focal length f of 50 mm is used.

[0080] The workpiece is made of alumina ceramic with a thickness of 0.28mm.

[0081] The scribing speed (moving speed of the beam spot) SP was set at 50 mm / sec.

[0082] The depth of the scribe groove was measured at points (10 μm pitch) ...

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Abstract

The invention relates to a laser scribing method and device. The method comprises the following steps: enabling a plurality of light beam spots, which are arranged in the scribing direction, to form on a workpiece in a separate state; and enabling the light beam spots to move in the scribing direction, thereby forming a linear scribed groove in the workpiece. The light beam spots are obtained from a single laser beam. The invention can be used for forming a deeper scribed groove with lower energy, or increasing the scribing speed on the premise of not complicating the structure of the device.

Description

technical field [0001] The invention relates to a method and a device for forming a linear scribing groove on a workpiece. Background technique [0002] A method for forming scribe grooves and holes for division on a workpiece is generally to move the irradiation position of the laser beam on the workpiece while irradiating the workpiece with a laser beam from a laser source. In laser scribing of ceramics etc., a Q-switched laser is usually used as a laser source. [0003] Scribing grooves and holes are preferable because the deeper the grooves and holes are, the easier and more sure the workpiece can be cut. However, in order to deepen the depth of grooves and holes, it is necessary to increase the power density or energy density of the concentrated laser at the position of the laser workpiece. Therefore, when the output power of the laser is limited, although a deeper scribed groove can be realized by prolonging the irradiation time of the laser (reducing the scanning sp...

Claims

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Application Information

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IPC IPC(8): B25H7/04B23K26/36B23K26/362
Inventor 梶川敏和
Owner SEISHIN TRADING
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