Detinning processing method of chip and chip detinning machine applying method

Abstract

The invention discloses a detinning processing method of a chip, and the method comprises the following steps: providing a scraper, a die, a heating mechanism and a recovery device, wherein a first inclined plane which forms an inclination angle with the horizontal plane is arranged on the upper surface of the die, a plurality of grooves for accommodating and fixing chips are formed on the first inclined plane, the height of each groove is equivalent to the thickness of each chip, and the recovery device is arranged on one side corresponding to the lower edge of the first inclined plane belowa conveying mechanism; arranging the chips in the grooves; placing the die on the heating mechanism, and utilizing the heating mechanism to heat the chips so as to melt soldering tin on the chips; and utilizing the scraper to scrape the soldering tin on the chips into the recovery device. In the method, the scraper is utilized for scraping off the molten soldering tin form the chips, the soldering tin can stably slide into the recovery device along the wall of the scraper, the loss of the soldering tin is low, and the recovery rate is high; and furthermore, the plurality of the grooves are arranged on the die, the plurality of the chips can be scraped according to needs, and the tin scraping efficiency is high. In addition, the invention further provides a chip detinning machine applying the detinning processing method of the chip.

Description

technical field [0001] The invention relates to the field of electronic circuits, in particular to a chip tin removal processing method and a chip tin removal machine using the method. Background technique [0002] With the development of science and technology, all walks of life are developing toward automation and intelligence. Computers and other smart devices are widely used. Smart devices have various integrated circuit boards. In the production process of integrated circuit boards, there will inevitably be unqualified products, or the integrated circuit boards will fail after a period of use. When a problem occurs, many circuit components on the integrated circuit board are intact, so the circuit components need to be removed from the integrated circuit board for reuse. In the process of removing the circuit components, firstly, the soldering tin connected to the circuit components on the PCB needs to be removed. At present, there are various tin removal machines on...

AI Technical Summary

Problems solved by technology

[0003] However, due to the strong wind force of the air knife, the solder that is blown off may not be blown into the predetermined recovery device, so it will cause a certain degree of waste of solder; on the other hand, the efficiency of this type of tin removal machine needs to be improved

Images