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Formula of flux for hot tinning of copper wire and preparation method thereof

A flux and hot-dip tinning technology, which is applied in hot-dip plating process, welding medium, manufacturing tools, etc., can solve problems such as darkening, pitting on the surface of finished products, and unsatisfactory solder layer, etc., and achieve high chemical activity and activation rate. The effect of stabilizing acid-base balance and reducing surface tension

Inactive Publication Date: 2011-07-13
震雄铜业集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Many common fluxes are suitable for tinning copper wires with lead-free tin, but the tinning effect is not good, and cannot fully achieve solder gloss, roundness, and high compactness. The surface of the finished product has pits, black spots, exposed copper, and crystallization Rough and not tight defects are prone to produce more cusps and unfulfilled solder layers. During the soldering process, there are more oxides, oxidized slag, white and black oil stains on the surface of the tin liquid.
Ordinary fluxes have a short shelf life after tinning, and are prone to oxidation, yellowing, discoloration, and darkening, and cannot achieve the intended effect when producing fine and ultra-fine lines. The fluidity of tin liquid and surface activation performance are not good, and it is prone to Phenomena such as mold blockage and wire breakage
Substances such as "hydrazine hydrate" and "hydrazine" are used as the reducing atmosphere and protective atmosphere in hot-dip tinning, but "hydrazine hydrate" itself is carcinogenic, and it needs to be pickled with hydrochloric acid during the preparation operation. , Many common fluxes are added with such chemical reagents, which pollute the environment and cannot fully meet the requirements of the RoHS environmental protection system

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Composition mass percentage

[0020] Ammonium Chloride 1.5%

[0021] Zinc chloride 5.0%

[0022] Triethanolamine 5.0%

[0023] OP-10 Emulsifier 2.0%

[0024] Hydrochloric acid 7.0%

[0025] The balance is deionized water.

[0026] The preparation of above-mentioned flux for hot-dip tinning comprises the following steps:

[0027] a. prepare deionized water by mass percentage example 79.5%;

[0028] b. Add 1.5% ammonium chloride in deionized water according to the mass percentage, stir well until all dissolve;

[0029] c. add 5.0% zinc chloride by mass percentage in the solution obtained in the previous step, fully stir until all dissolve;

[0030] d. Add 5.0% triethanolamine in the solution obtained in the previous step by mass percentage, and stir until it is completely dissolved;

[0031] e. Add 2.0% OP-10 emulsifier in the solution obtained in the previous step according to the mass percentage, and stir until it is completely dissolved;

[0032] f. Add 7.0% h...

Embodiment 2

[0034] Composition mass percentage

[0035] Ammonium chloride 0.5 %

[0036] Zinc chloride 2.0%

[0037] Triethanolamine 0.2%

[0038] OP-10 emulsifier 0.1 %

[0039] Hydrochloric acid 5. 0 %

[0040] The balance is deionized water.

[0041] The preparation of above-mentioned flux for hot-dip tinning comprises the following steps:

[0042] a. prepare deionized water by mass percentage example 92.2%;

[0043] b. Add 0.5% ammonium chloride in deionized water according to the mass percentage, stir well until all dissolve;

[0044] c. Add 2.0% zinc chloride by mass percentage in the solution obtained in the previous step, fully stir until all dissolve;

[0045] d. Add 0.2% triethanolamine in the solution obtained in the previous step by mass percentage, stir well until all dissolve;

[0046] e. Add 0.1% OP-10 emulsifier in the solution obtained in the previous step according to the mass percentage, and stir until it is completely dissolved;

[0047] f. Add 5.0% hydrochlor...

Embodiment 3

[0049] Composition mass percentage

[0050] Ammonium chloride 1.0 %

[0051] Zinc chloride 3.0%

[0052] Triethanolamine 0.5%

[0053] OP-10 emulsifier 0.5 %

[0054] Hydrochloric acid 5.0 %

[0055] The balance is deionized water.

[0056] The preparation of above-mentioned flux for hot-dip tinning comprises the following steps:

[0057] a. prepare deionized water by mass percentage example 90.0%;

[0058] b. Add 1.0% ammonium chloride in deionized water according to the mass percentage, and stir until it is completely dissolved;

[0059] c. Add 3.0% zinc chloride by mass percentage in the solution obtained in the previous step, fully stir until all dissolve;

[0060] d. Add 0.5% triethanolamine in the solution obtained in the previous step by mass percentage, stir fully until all dissolve;

[0061] e. Add 0.5% OP-10 emulsifier in the solution obtained in the previous step according to the mass percentage, and stir until it is completely dissolved;

[0062] f. Add 5....

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Abstract

The invention relates to a formula of a flux for hot tinning of a copper wire and a preparation method thereof. The formula is used for tight tinning on the surface of the hot tinned copper wire and characterized by comprising the following components in percentage by mass: 0.5 to 1.5 percent of ammonium chloride, 2.0 to 5.0 percent of zinc chloride, 0.2 to 5.0 percent of triethanolamine, 0.1 to 2.0 percent of OP-10 emulsifying agent, 5.0 to 7.0 percent of hydrochloric acid and the balance of deionized water. Through the flux, the tinned copper wire has uniform coating, tight structure and excellent performance, and environmental pollution and resource waste are not caused.

Description

technical field [0001] The invention belongs to the technical field of hot-dip tinning technology, and relates to a flux formula and a preparation method of the copper wire hot-dip tinning technology. Background technique [0002] The lead wires of electronic circuit boards, diodes, microelectronic connecting wires and other products need good soldering performance and oxidation resistance, and hot-dip tinned copper wires are mostly used in the industry. Because ordinary copper wires are exposed to air and contain a large number of oxygen molecules in the air, the reaction between copper and oxygen molecules can easily lead to copper corrosion in a short time. Plating a layer of tin on the copper surface can make it fast soldering on the electronic circuit board and prevent the oxidation of the copper wire, so tinned copper wire is widely used in the electronics industry. Flux must be used to assist soldering when tinning copper wires. [0003] The hot-dip tinning process ...

Claims

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Application Information

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IPC IPC(8): C23C2/08C23C2/02B23K35/362
Inventor 赵磊张学东何军华杨崇伟
Owner 震雄铜业集团有限公司
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