Crystal-block bonding rod slicing process

Abstract

The invention relates to a crystal-block bonding rod slicing process. The process comprises the following steps: adhering more than two crystal blocks on the same glass plate to form a crystal-block bonding rod, wherein unqualified semi-finished product crystal blocks which are not cut are arranged on two ends of the crystal block; unqualified parts of the two adjacent crystal blocks are closely connected, and the connecting gap of the unqualified parts of the two adjacent crystal blocks is filled with glue; and the crystal block is sliced by a slicing machine after the glue is solidified. The crystal-block sliced bonding rod is a seamless bonding rod, and the unqualified parts on two ends of the crystal block are not required to be cut before the crystal block is sliced so as to save a cutting process and eliminate bevel, line trace and cut trace caused by cutting two ends of the crystal block; therefore, the problem of high proportion of hidden splinters, thick and thin slices, line traced slices, notch slices and fragment on two ends of the crystal block in a slicing process is fundamentally solved, occurrence of broken line is avoided, yield and capacity of silicon slices is greatly improved, and quality guarantee is provided for the silicon slices on a battery end.

Description

technical field [0001] The invention relates to the technical field of solar cell crystal block slicing, in particular to a crystal block sticky rod slicing process. Background technique [0002] At present, when slicing solar cell ingots, usually before the ingots enter the slicing machine for slicing, structural steel wires, diamond wires or band saws are used to cut off the unqualified parts at both ends of the ingots, such as impurity layers or low carrier counts. Life layer, etc., and then fix the crystal block on the crystal support and enter the slicer table for slicing. However, it is unavoidable that inclined planes, line marks, and knife marks will be produced at both ends of the crystal block during the cutting process. During the slicing process of the crystal block, the slopes, line marks and knife marks at both ends of the crystal block are likely to bend the cutting steel wire, "climbing lame phenomenon", and even cause the steel wire to break, so that a larg...

AI Technical Summary

Problems solved by technology

However, in the cutting process, it is unavoidable that there will be inclined planes, line marks, and knife marks at both ends of the crystal block.

During the slicing process of the crystal block, the slopes, line marks and knife marks at both ends of the crystal block are likely to bend the cutting steel wire, "climbing lame phenomenon", and even cause the steel wire to break, so that a large number of Hidden cracks, thick and thin slices, line marks, missing corners and fragments, even lead to the scrapping of the entire crystal block, seriously affecting the efficiency of slicing

At present, there is no solution in the industry at home and abroad to solve the ratio of hidden cracks, thick slices, line marks, missing corners and fragments at both ends of the crystal block during the slicing process caused by the bevels at both ends of the crystal block, line marks, and knife marks. Reports of positive and effective methods of staying high or even scrapping the whole knife

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