Laser working apparatus, and laser working method

A laser processing method and laser processing technology, which can be used in fine working devices, stone processing equipment, laser welding equipment, etc., and can solve problems such as insufficient cooling

Inactive Publication Date: 2011-06-08
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method of blowing gas (which can also contain liquid) in a non-contact state may not be sufficiently cooled by the usual cooling method today.

Method used

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  • Laser working apparatus, and laser working method
  • Laser working apparatus, and laser working method
  • Laser working apparatus, and laser working method

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Experimental program
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Embodiment Construction

[0064] (Embodiment 1)

[0065] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0066] figure 1 It is an overall configuration diagram of a substrate processing apparatus LS1 capable of implementing the processing method of the present invention. figure 2 It is a partial configuration diagram showing the configuration of a substrate cooling mechanism that is a part of the substrate processing apparatus LS1.

[0067] In the present embodiment, although a processed glass substrate is taken as an example, the same applies to substrates made of brittle materials such as silicon substrates. Also, although it is described that ice is used as the solid-phase refrigerant, other solid-phase refrigerants (liquid alcohol is used in the case of solid alcohol, and liquefied carbon dioxide gas is used in the case of dry ice) are also the same.

[0068] First, the overall configuration of the substrate processing apparatus LS1 will be described...

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PUM

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Abstract

Provided are a laser working method and a laser working apparatus using a cooling method by a solid contact, which are freed from the problem of producing metal powder, the problem of sticking blots of a cooling member to a substrate, and the development of flaws by frictions. The laser working apparatus comprises a laser irradiation mechanism for forming a beam spot on a fragile material substrate, a substrate cooling mechanism for forming a cooling region, and a scanning mechanism for moving the beam spot and the cooling region relatively in the order of the beam spot and the cooling region along a scheduled working line set on the substrate. The substrate cooling mechanism includes a solid-phase coolant solidified by cooling a coolant material taking a gas or liquid phase at the ordinary temperature, and a push mechanism for causing the solid-phase coolant to contact the substrate.

Description

technical field [0001] The present invention relates to a brittle material substrate processing device and processing method using laser irradiation, and particularly relates to a laser processing device and a laser processing method that apply thermal stress to a substrate by heating due to laser irradiation and cooling immediately thereafter to generate cracks. [0002] Here, the brittle material substrate refers to glass substrates, ceramics made of sintered materials, single crystal silicon, semiconductor wafers, sapphire substrates, ceramic substrates, and the like. Background technique [0003] If a laser scribing process is used to irradiate a brittle material substrate such as a glass substrate with a laser beam, scan the beam spot formed on the substrate, heat it in a linear shape, and blow a refrigerant immediately after heating to cool it, it is different from a mechanical process such as a cutter wheel. Compared with machining, the generation of chips can be redu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/40B23K26/38B23K26/42B28D5/00C03B33/09H01L21/301B23K26/00B23K26/364
CPCB23K26/4075B28D5/0011C03B33/091B23K26/423B23K26/40B23K26/703B23K2103/50
Inventor 清水政二
Owner MITSUBOSHI DIAMOND IND CO LTD
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