Temperature-controlled radiator

Abstract

The invention discloses a temperature-controlled radiator, comprising a hot plate, a cold plate, a thermo-electronic chip (TEC) module, an annular heat pipe, a temperature detector and a TEC switch control unit, wherein the hot plate and the cold plate are arranged in parallel; the TEC module is arranged between the hot plate and the cold plate; the hot end of the TEC module is connected with thehot plate, and the cold end of the TEC module is connected with the cold plate; the cold plate is connected with a heat source of which the heat is radiated; the annular heat pipe passes through the hot plate and the cold plate respectively; the temperature detector is used for detecting to obtain a temperature value of the cold plate or the temperature value of the environment close to the heat source of which the heat is radiated, and sending the temperature value of the cold plate or the environmental temperature value to the TEC switch control unit as a detection value; the TEC switch control unit is used for comparing the detection value with a corresponding preset critical temperature value; and the TEC module is controlled to switch on / off in accordance with a comparison result. Byusing the temperature-controlled radiator, the service life of a semiconductor radiator can be prolonged and the electric energy is saved as well.

Description

technical field [0001] The invention relates to the field of chip heat dissipation, in particular to a temperature-controlled heat dissipation device. Background technique [0002] At present, a semiconductor refrigerator (TEC: Thermo-electronic chip) has been widely used. TECs are made using the Peltier effect of semiconductor materials. [0003] The so-called Peltier effect refers to the phenomenon that when a direct current passes through a galvanic couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. TEC includes a number of N-type and P-type semiconductors, which are connected together through electrodes, and ceramic sheets or metal sheets are welded on the upper and lower sides. When current is passed, according to the Peltier effect, a temperature difference is generated between the upper and lower sides of the N-type and P-type semiconductors. This results in a cold end and a hot end. [0004] refer to figure 1 Sho...

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Problems solved by technology

[0007] In the process of realizing the present invention, the inventor found that when using TEC to dissipate heat from the heat-consuming chip, the TEC must work for a long time, which leads to a reduction in the service life of the TEC, which is easily damaged and has low reliability; at the same time, the TEC works for a long time and consumes electric energy. Not conducive to energy saving

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