Mems microphone and method for manufacturing same

A technology of microelectronic machinery and manufacturing methods, which is applied in the direction of electrostatic transducer microphones, microphones, microelectronic microstructure devices, etc., can solve the problems of higher microphone height, higher manufacturing unit price, and increased manufacturing process, and achieve reduction Height, reduction of manufacturing process, effect of preventing cracking

Inactive Publication Date: 2011-05-11
BSE CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Furthermore, it is difficult to manufacture the microelectromechanical system chip and the AISIC chip into one chip, so the microelectromechanical system chip and the ASIC chip are manufactured in separate processes, thereby increasing the manufacturing process and increasing the manufacturing unit price.
[0010] In addition, the above two reference documents have a structure in which a film and a support plate are laminated on a silicon substrate, so the height of the MEMS microphone can only be increased
Therefore, there are limitations on the manufacture of miniaturized microphones

Method used

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  • Mems microphone and method for manufacturing same
  • Mems microphone and method for manufacturing same
  • Mems microphone and method for manufacturing same

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Embodiment Construction

[0050] Specific examples of the MEMS microphone of the present invention to achieve the above object will be described.

[0051] A first embodiment of the MEMS microphone of the present invention will be described.

[0052] Figure 1a to Figure 1c is a cross-sectional view showing a step of forming a void forming portion on a silicon substrate in the first embodiment of the MEMS microphone of the present invention.

[0053] refer to Figure 1a and Figure 1b , the MEMS microphone includes a silicon substrate 10 . On both sides of the silicon substrate 10, silicon nitride (Si 3 N 4 ) or silicon oxide (SiO 2 ) and other insulating protective layers 11, 12 (refer to Figure 1a ). At this time, the silicon nitride is vapor-deposited with protective layers 11 and 12 on the surface of the silicon substrate 10 by low pressure vapor deposition (LPCVD: Low Pressure Chemical Vapor Deposition).

[0054] The insulating protective layer 11 on the upper side of the silicon substrate...

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Abstract

The present invention relates to a MEMS microphone and to a method for manufacturing same, which are capable of precisely forming a gap between a membrane and a back plate by forming an air-gap-forming portion on a silicon substrate and then depositing the membrane and back plate thereon. Also, according to the MEMS microphone and method for manufacturing same, by manufacturing the membrane and / or back plate using an electroless plating process, the planarizing process of a sacrificial layer can be simplified, and reducing and controlling residual stress can be rendered easy. The MEMS microphone according to the present invention comprises: a silicon substrate defining a back chamber and an air-gap-forming portion formed by means of etching into a top of the back chamber up to a predetermined depth; a membrane deposited on the air-gap-forming portion of the silicon substrate or on the silicon substrate; and a back plate deposited on the air-gap-forming portion or on the silicon substrate so as to be separated from the membrane and to form a gap with the membrane for an air gap.

Description

technical field [0001] The invention relates to a micro-electro-mechanical system microphone and a manufacturing method thereof. Background technique [0002] In general, a microphone is a device that converts sound into an electrical signal. The microphone can be applied to various communication devices such as mobile communication devices such as mobile terminals, earphones, or hearing aids. The microphone should have good electronic / acoustic performance, reliability and workability. [0003] The microphone includes a condenser microphone, a microelectromechanical system microphone (MEMS microphone), and the like. [0004] The condenser microphone is manufactured by separately manufacturing a diaphragm, a support plate, and a printed circuit board for signal processing, etc., and then assembling the above-mentioned components inside a case. Since the process of manufacturing the printed circuit board and the process of manufacturing the condenser microphone are separate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R31/00B81B3/00B81B7/00B81C1/00
CPCB81B2201/0257B81B2203/0127B81C1/00158H04R19/04C23C18/16H04R31/006H04R2201/003
Inventor 宋青淡金容国
Owner BSE CO LTD
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