Heating fixture of packaging lineup process and method thereof

Abstract

The invention discloses a heating fixture of packaging lineup process and a method thereof, wherein the heating fixture comprises a carrier block and a clamping block; and the clamping block is used for clamping a packaging carrier, so that the packaging carrier is clamped between the carrier block and the clamping block. The clamping block is provided with at least one heating component used forheating a first region of the packaging carrier to a first temperature; and a second region of the packaging carrier has a second temperature, and the second temperature is relatively lower than the first temperature. Therefore, the heating fixture ensures that the hardness of a welding pad of a chip on the second region of the packaging carrier is maintained at a proper preset hardness value so as to improve the combination reliability and combination non-defective rate of a lead and the welding pad; and lineup positions on the first region are warmed, thus the lead is easy to joint.

Description

【Technical field】 [0001] The present invention relates to a heating jig and method for packaging wire bonding process, in particular to a heating jig for temporarily carrying, clamping and heating a packaging carrier during the wire bonding process. and its methods. 【Background technique】 [0002] The semiconductor packaging process is used to provide a packaging structure to protect a semiconductor chip, so that the semiconductor chip can avoid external force impact, dust pollution, moisture or oxidation when it is powered on, so that the packaging structure can be used to improve the reliability of the semiconductor chip and prolong the life of the semiconductor chip. its service life. In the existing manufacturing process of semiconductor packaging, semiconductor wafers are usually obtained first and wafer tests are performed on them. After passing the test, the semiconductor wafers will then be cut into several semiconductor chips, and each semiconductor chip will be bo...

AI Technical Summary

Problems solved by technology

[0005] However, the design of the heating fixture of the lead frame has the following disadvantages: since the heating block 12 is integrally formed, the chip holder 112 is also increased when the inner pin part 111a is heated. temperature, and jointly heated the bonding pad 131 of the semiconductor chip 13

However, the one-piece design of the heating block 12 of the heating fixture of the substrate is also easy to overheat the solder pads 131 of the semiconductor chip 13 to make them excessively softened, thus causing disadvantages such as damage to the solder pads 131 during wire bonding.

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