Electrostatic chuck and method for eliminating residual electric charges of electrostatic chuck

Abstract

The invention provides an electrostatic chuck, which comprises a substrate, an electrode arranged in the substrate, and an electric charge release unit, wherein the electrode can selectively be connected with a power supply at the outer part of the electrostatic chuck or the electric charge release unit, so that in the process of machining, the electrode is connected with the power supply so as to obtain electric energies, and in the process of electric charge release, the electrode is connected with the electric charge release unit so as to release the residual electric charges on the electrodes and then eliminate the residual electric charges on the manufacturing workpieces loaded on the electrostatic chuck. In addition, the invention also provides a method for eliminating the residual electric charges of the electrostatic chuck. The electrostatic chuck and the method provided by the invention can thoroughly and quickly release the residual electric charges on the electrodes and wafers by aid of the electric charge release unit, thereby eliminating the phenomena of wafer sticking and shattering, and then reducing the phenomenon of process interrupt and improving the production efficiency and the product yield.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, in particular to an electrostatic chuck for supporting wafers in a reaction chamber and a method for eliminating residual charges on the electrostatic chuck. Background technique [0002] Since the advent of the first transistor for more than half a century, semiconductor technology has affected people's lives in various fields, promoted the development of human civilization, and created an immeasurably huge industry. The miniaturization and low power consumption of integrated circuits have increased the demand for semiconductors. However, with the increase in capital investment, problems such as integrated circuit process development costs and manufacturing costs have become more and more prominent. Therefore, improving efficiency and reducing costs have become the concerns of production enterprises. [0003] Generally, the manufacturing process of integrated circuits is a highly auto...

AI Technical Summary

Problems solved by technology

[0007] However, in practical applications, the above method of applying reverse voltage cannot completely eliminate the static charge on the electrodes and wafers

This is because: the elimination of static charges is usually affected by various factors, such as process conditions, the level of reverse voltage, the time of applying reverse voltage, etc. It is difficult to overcome the influence of the above-mentioned factors, so it is difficult to remove the static charge more thoroughly.

The presence of residual charges on the electrodes and the wafer will cause sticking, and cause the wafer to deviate or fall off when the needle is raised, so that the manipulator cannot take out the wafer.

Moreover, the more the residual charge is, the more serious the sticking phenomenon will be, so that fragmentation will still occur when it is serious, which will affect the smooth progress of the process.

[0008] For this reason, those skilled in the art try to obtain the corresponding relationship between the process and the parameters of the reverse voltage through a large number of experiments, and hope to completely eliminate the However, in practical applications, this method not only increases the complexity of the equipment and prolongs the production cycle, but also cannot completely eliminate the residual charge

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