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Two-sided adhesive tape and wiring circuit board

A technology of double-sided adhesive tape and wiring circuit board, which is applied in the direction of printed circuit, adhesive type, printed circuit manufacturing, etc., can solve the problems of adhesive tape breakage and insufficient strength, and achieve excellent punching processability, not easy Adhesive tape breakage, effective effect of thin film

Active Publication Date: 2011-04-20
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even in the case of these double-sided adhesive tapes having a base material, for example, when the nonwoven fabric as the base material is thinned, problems such as insufficient strength and breakage of the adhesive tape during production may occur.

Method used

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  • Two-sided adhesive tape and wiring circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] As the nonwoven fabric base material, as shown in Table 2, a nonwoven fabric prepared by sheet-fringing 80% by weight of Manila hemp / 20% by weight of wood pulp by a cylinder method was used.

[0089] In 210 parts by weight of ethyl acetate, in the presence of 0.4 parts by weight of 2,2'-azobisisobutyronitrile and under nitrogen replacement conditions, 90 parts by weight of acrylic acid-2 was stirred at 60 to 80° C. - Ethylhexyl ester and 10 parts by weight of acrylic acid were subjected to solution polymerization to prepare an acrylic polymer solution (viscosity: about 120 poise, polymerization rate: 99.2%, solid content: 30.0% by weight).

[0090] To the above solution, 20 parts by weight of a terpene phenol-based tackifying resin (trade name "YS Polisita-S145", manufactured by ヤスハラケミカル Co., Ltd., softening point 145° C.) and 0.05 parts by weight were added with respect to 100 parts by weight of the acrylic polymer. A polyfunctional epoxy-based crosslinking agent (trad...

Embodiment 2、3

[0092] Examples 2, 3, Comparative Example 1

[0093] As shown in Table 2, except having changed the nonwoven fabric base material, the thickness of the pressure-sensitive adhesive layer, and the like, it was carried out in the same manner as in Example 1 to obtain a double-sided pressure-sensitive adhesive tape.

[0094] (Evaluation)

[0095] The following evaluations were performed on the double-sided pressure-sensitive adhesive tapes obtained in the above-mentioned Examples and Comparative Examples. The evaluation results are shown in Table 2.

[0096] (1) Workability at the time of production of double-sided adhesive tape (substrate breakability)

[0097] The ease of breakage of the base material (nonwoven fabric base material) at the time of production of the double-sided pressure-sensitive adhesive tape in Examples and Comparative Examples was evaluated according to the following criteria.

[0098] The substrate is not easy to break when the substrate is operated durin...

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Abstract

Provided is a two-sided adhesive tape which has an adhesive layer on both sides of a non-woven fabric including at least manila hemp having a thickness less than 18 [mu]m and a tensile strength in the lengthwise direction of at least 4 N / 15 mm. The two-sided adhesive tape is effective in reducing the size of products fixed by using the tape and producing thinner films because of the thinness of the tape. Furthermore, the strength in the lengthwise direction increases, and the tape does not break in manufacturing and finishing processes. In addition, the piercing characteristic is also superior because of the non-woven fabric base. Therefore, the tape is particularly useful as a two-sided adhesive tape for fixing a wiring circuit board.

Description

technical field [0001] The present invention relates to double-sided adhesive tapes. More specifically, the present invention relates to a double-sided pressure-sensitive adhesive tape for a printed circuit board and a printed circuit board using the double-sided pressure-sensitive adhesive tape. Background technique [0002] Wiring circuit boards are used in electronic equipment, and as the wiring circuit boards, flexible printed circuit boards (sometimes referred to as "FPCs") are widely used. Wiring circuit boards such as FPC are usually used in a state of being glued to a reinforcing plate (aluminum plate, stainless steel plate, polyimide plate, etc.), and in this case, a double-sided adhesive tape or sheet is used (double-sided adhesive tape or sheet) (hereinafter, double-sided adhesive tapes or sheets are collectively referred to as "double-sided adhesive tapes"). As such a double-sided pressure-sensitive adhesive tape, a double-sided pressure-sensitive adhesive tape...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/04C09J133/00C09J161/06H05K1/02C09J7/21
CPCH05K1/0393H05K3/386C09J2201/128C09J2400/263H05K2203/0191H05K3/0061C09J7/04C09J7/21Y10T428/265C09J2301/124
Inventor 野中崇弘大学纪二大浦正裕
Owner NITTO DENKO CORP
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