Production method of multi-layer printed circuit board and multi-layer printed circuit board

Abstract

The invention relates to a production method of a multi-layer printed circuit board and the multi-layer printed circuit board, and the production method of the multi-layer printed circuit board comprises the following steps: step 1) providing an insulating light board with the required thickness, and carrying out roughening treatment on the insulating light board; and step 2) using the insulating light board after the roughening treatment to replace part of semi-curing sheets in a core plate or between the core plate and an outer layer of copper so as to produce a multi-layer plate with the structure comprising a plurality of semi-curing sheets, and carrying out lamination according to curing conditions required for the resin type of the used semi-curing sheets, thus obtaining the multi-layer printed circuit board. In the production method, the insulating light board after the roughening treatment is used to replace part of the semi-curing sheets, is used for producing the multi-layer plate with the structure comprising the plurality of the semi-curing sheets, thus the problems of an inter-layer sliding plate and non-uniform thickness caused by large adhesive flow can be solved; the interface bonding force can achieve the effect of using an etched copper-clad plate; and compared with the use of the etched copper-clad plate in the prior art, the production method has the advantages of high efficiency, low cost, low pollution discharge and the like.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a production method of a multilayer printed circuit board and the multilayer printed circuit board. Background technique [0002] There are certain requirements for the outer layer copper and the core board or the dielectric layer between the core boards in the multi-layer board, which is generally realized through the combination of prepreg. The existing multilayer board structure, as shown in the figure, includes: two outer layers of copper 1, a core board 3 disposed between the outer layers of copper 1 and several layers of prepregs, wherein several layers of prepregs are arranged between the core board 3 and the core board. Between the boards 3 and between the outer layer copper 1 and the core board 3, each layer of prepreg includes multiple prepregs 2, and the pressure plate with multiple prepregs 2 structures is prone to large flow of glue, resulting in uneven thicknes...

AI Technical Summary

Problems solved by technology

[0004] Another object of the present invention is to provide a multi-layer printed circuit board produced by the above-mentioned production method, which solves the problems of inter-layer slides and uneven thickness due to large glue flow, and has high efficiency, low cost and low pollution emissions. advantage

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