Conformal coating for protecting printed circuit board, preparation method and curing method thereof
A printed circuit board and overlay technology, which is applied in the field of overlay coating and its preparation, can solve the problems of inability to cure, limit the application of circuit boards, and the inability of effective protection of circuit boards to achieve excellent adhesion and excellent Adhesive effect
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Embodiment 1
[0027] This embodiment provides a kind of coating used for protecting printed circuit boards, which is a kind of light and moisture curing coating used for protecting printed circuit boards. The coating includes the following components by mass percentage :
[0028] Raw material mass percentage (%)
[0029] Polyurethane Acrylic 60
[0030] Ethoxylated trimethylolpropane triacrylate (reactive diluent) 10
[0031] 1,6-hexanediol diacrylate (reactive diluent) 15.45
[0032] Tripropylene glycol diacrylate (reactive diluent) 10
[0033] 2-Hydroxy-2-methyl-1-phenyl-1-propanone (photoinitiator) 4
[0034] BYK-333 (leveling agent for additives) produced by BYK, Germany 0.15
[0035] Dabco T12 (auxiliary drier) produced by Deqian Hemings Company 0.35
[0036] Tinopal OB (fluorescent agent in auxiliary agent) produced by Swiss Ciba Fine Chemicals 0.05;
[0037] The polyurethane acrylic resin used in the above-mentioned covering coating adopts the polyurethane acrylate with double...
Embodiment 2
[0057] This embodiment provides a kind of coating used for protecting printed circuit boards, which is a kind of light and moisture curing coating used for protecting printed circuit boards. The coating includes the following components by mass percentage :
[0058] Raw material mass percentage (%)
[0059] Polyurethane Acrylic 63
[0060] Ethoxylated trimethylolpropane triacrylate (reactive diluent) 20
[0061] 1,6-hexanediol diacrylate (reactive diluent) 5
[0062] Tripropylene glycol diacrylate (reactive diluent) 5
[0063] 2-Hydroxy-2-methyl-1-phenyl-1-propanone (photoinitiator) 5.45
[0064] Levaslip 836 (leveling agent for additives) produced by Deqian Hemings 0.5
[0065] Dabco 120 (drying agent for additives) produced by American Air Chemical Company 1
[0066] Tinopal OB (fluorescent agent for additives) produced by Swiss Ciba Specialty Chemicals 0.05
[0067] The polyurethane acrylic resin used in the above-mentioned covering coating adopts the polyurethane ac...
Embodiment 3
[0087] This embodiment provides a kind of coating used for protecting printed circuit boards, which is a kind of light and moisture curing coating used for protecting printed circuit boards. The coating includes the following components by mass percentage :
[0088] Raw material mass percentage (%)
[0089] Urethane Acrylic 30
[0090] Ethoxylated trimethylolpropane triacrylate (reactive diluent) 25
[0091] 1,6-Hexanediol Diacrylate (HDDA) (reactive diluent) 25
[0092] Tripropylene glycol diacrylate (TPGDA) (reactive diluent) 10
[0093] 1-Hydroxy-cyclohexyl benzophenone (photoinitiator) 8
[0094] Levaslip 810 (leveling agent for additives) produced by Deqian Hemings Company 0.45
[0095] Dabco T12 (auxiliary drier) produced by American Air Chemical Company 0.45
[0096] Tinopal OB (fluorescent agent for additives) produced by Swiss Ciba Specialty Chemicals 0.1
[0097] The polyurethane acrylic resin used in the above-mentioned covering coating adopts the polyurethan...
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