Plasma cleaning apparatus for a semiconductor panel with cleaning chambers

Abstract

The present invention relates to plasma cleaning apparatuses for cleaning semiconductor components (a cleaning object or a PCB board) with plasma discharge in a semiconductor fabrication process. More specifically, the present invention relates to a semiconductor plasma cleaning apparatus with cleaning chambers (100) for improving working efficiency by making continuous plasma cleaning of cleaning objects placed in magazines. The semiconductor plasma cleaning apparatus having a plurality of cleaning chambers (100), includes the plurality of cleaning chambers (100) arranged in parallel vertically, an unloading unit (200) movable in up / down direction according to a cleaning progress Situation for transferring magazines having cleaning objects loaded thereon to front of each of the cleaning chambers (100) in succession, a plurality of first pushers (250) mounted to the unloading unit (200) for pushing and discharging the cleaning object loaded in the magazine being transferred by the unloading unit (200) toward the cleaning chamber one by one, a rotatable transfer unit (300) for receiving an empty magazine having all the cleaning objects discharged from the unloading unit (200), rotating the empty magazine by 180 horizontally, and transferring the empty magazine to rear of the plasma cleaning chamber, a loading unit (400) for receiving the empty magazines from the rotatable transfer unit (300), and transferring the empty magazines to rear of each of the plasma cleaning chambers (100) in succession while moving from an lower side to an upper side according to the cleaning progress situation, and a second pusher (500) for pushing and loading the cleaning objects having cleaning thereof finished into the empty magazine at the loading unit (400).

Description

technical field [0001] The present invention relates to a plasma cleaning apparatus for cleaning semiconductor elements (cleaning objects or PCB boards) using plasma discharge in semiconductor manufacturing processes. More particularly, the present invention relates to a semiconductor plasma cleaning apparatus having a cleaning chamber that improves work efficiency by performing continuous plasma cleaning on semiconductor elements placed in a cassette. Background technique [0002] Generally, plasma cleaning equipment used in semiconductor manufacturing processes, which is equipment for cleaning semiconductor elements (for example, cleaning objects and PCBs) using plasma discharge, is provided for each semiconductor process in order to clean the semiconductor elements (hereinafter In this paper, it is called the surface of the cleaning object). [0003] That is, the cleaning object goes through the steps of peeling, die bonding, wire bonding, package molding, marking, etc.,...

AI Technical Summary

Problems solved by technology

[0009] However, the plasma cleaning apparatus 1 of the related art has a problem that cleaning efficiency and productivity of cleaning objects L are very low because the plasma cleaning apparatus 1 of the related art requires a worker to load the cassette 60 loaded with the object L of cleaning therein into a cassette. 20, then the cassette 20 is loaded into the chamber 10, and after cleaning is completed, the cassette 20 is taken out from the chamber 10 again and a new cassette 20 is placed therein, a continuous cleaning process cannot be performed

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