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Alkaline non-cyanide copper plating solution taking amino methylene diphosphonic acid as main coordinating agent

A technology of aminomethylene diphosphonic acid and cyanide-free copper plating, which is applied in the field of surface treatment and can solve the problems of low cathodic current efficiency, low deep plating capacity, and environmental pollution in cyanide plating solutions

Inactive Publication Date: 2011-02-16
HANGZHOU AMAER TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides an alkaline cyanide-free copper plating solution that does not contain cyanide, which solves the serious environmental pollution caused by the cyanide-containing plating solution in the prior art, and the cathodic current efficiency of the cyanide plating solution is low and the deep plating ability is low. Small and other defects

Method used

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  • Alkaline non-cyanide copper plating solution taking amino methylene diphosphonic acid as main coordinating agent
  • Alkaline non-cyanide copper plating solution taking amino methylene diphosphonic acid as main coordinating agent
  • Alkaline non-cyanide copper plating solution taking amino methylene diphosphonic acid as main coordinating agent

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Embodiment 1

[0015] An alkaline cyanide-free copper plating solution composed of aminomethylene diphosphonic acid as the main complexing agent was prepared according to the following proportions.

[0016] Aminomethylene diphosphonic acid (AMDP) 70g / L

[0017] Copper sulfate pentahydrate 20g / L

[0018] Potassium hydroxide 80g / L

[0019] Potassium carbonate 40g / L

[0020] pH 9.7

[0021] Dissolve and mix the weighed aminomethylene diphosphonic acid and copper sulfate pentahydrate with deionized water, add potassium hydroxide solution while stirring, and finally add a certain amount of potassium carbonate and stir until completely dissolved.

[0022] In the obtained solution, adjust the temperature of the solution to 25°C, and the cathode current density is 1.5A / dm 2 Copper plating of about 6 microns is plated on the Φ2mm steel wire substrate, and the electroplating time is 15 minutes. According to ASTMB452-2002, the binding force is tested by winding method.

Embodiment 2

[0024] An alkaline cyanide-free copper plating solution composed of aminomethylene diphosphonic acid as the main complexing agent was prepared according to the following proportions.

[0025] Aminomethylene diphosphonic acid (AMDP) 82g / L

[0026] Copper chloride dihydrate 28g / L

[0027] Sodium hydroxide 75g / L

[0028] Sodium carbonate 50g / L

[0029] pH 9.2

[0030] Dissolve and mix the weighed aminomethylene diphosphonic acid and copper chloride dihydrate with deionized water respectively, add sodium hydroxide solution while stirring, and finally add quantitative sodium carbonate and stir until completely dissolved.

[0031]Zinc die-casting parts that have been pre-treated by ultrasonic degreasing and activation are charged into the tank for electroplating in the above solution. During electroplating, the temperature of the solution is controlled at 50°C and the cathode current density is 3A / dm. 2 , Plating time is 10 minutes. According to the electronic industry standard...

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Abstract

The invention provides alkaline copper plating solution taking amino methylene diphosphonic acid as main coordinating agent, relating to the field of non-cyanide plating. Plating solution is composed of the following components: amino methylene diphosphonic acid (AMDP) with the concentration of 30-120g / L, Cu2+ with the concentration of 3-25g / L, CO32- with the concentration of 10-80g / L and sodium hydroxide of potassium hydroxide used for regulating pH value of solution to be 7.5-13.5. The invention has the advantages that formula of plating solution is simple, no cyanide pollution is produced, covering power is high, cathode current efficiency is high, concentration polarization produced in plating process is small, allowable current density range is wide, copper plating can be directly carried out on ferric matrix, zinc or zinc alloy matrix and zinc dipped aluminium material, and copper coating having excellent bonding force with matrix is obtained.

Description

(1) Technical field [0001] The invention relates to a new alkaline cyanide-free copper plating solution, especially an alkaline cyanide-free copper plating solution with aminomethylene diphosphonic acid (AMDP) as the main complexing agent, which is used for iron, zinc or zinc Metal substrates such as alloys and galvanized aluminum are directly plated with copper, and can also be used for thickening the copper plating, which belongs to the technical field of surface treatment. (2) Background technology [0002] Because the acidic copper sulfate electroplating solution will directly plate copper on iron, zinc or zinc alloy, aluminum and other metal substrates, a displacement reaction will occur, resulting in poor bonding between the substrate and the copper coating. In order to obtain high binding force, alkaline cyanide plating solution is widely used in industry now. However, due to the very high biological toxicity of cyanide, it will cause major environmental and social s...

Claims

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Application Information

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IPC IPC(8): C25D3/38
Inventor 姜力强郑精武乔梁孙莉陈张强蒋梅燕
Owner HANGZHOU AMAER TECH
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