Variable-temperature metal module with precise temperature compensation and temperature compensating method

Abstract

The invention relates to a variable-temperature metal module with precise temperature compensation and a temperature compensating method. Sample holes are arranged on the variable-temperature metal module. The variable-temperature metal module comprises temperature compensating heaters, the arrangement number of the temperature compensating heaters is less than or equal to the arrangement number of the sample holes, the temperature compensating heaters are connected with a control circuit, and each temperature compensating heater is singly arranged around the sample holes. The invention is used for a gene amplifying instrument and a full-automatic medical PCR (Polymerase Chain Reaction) analytic system and can increase the temperature uniformity of the variable-temperature metal module to + / - 0.05 DEG C from + / -0.3 DEG C in the conventional technology.

Description

Technical field: [0001] The invention relates to a device and method with precise temperature compensation, which are used in a gene amplification instrument and a fully automatic medical PCR analysis system. Background technique: [0002] The working principle of the gene amplification (PCR) instrument is to complete the natural replication process similar to DNA through three basic reaction steps of denaturation-annealing-extension, repeat the above process, and the target gene to be tested can be amplified within 1 to 2 hours. Amplify several million times, so as to realize the qualitative detection of genes. [0003] The working principle of the fully automatic medical PCR analysis system is to add a fluorescent labeled probe to the PCR reaction system, and the excited fluorescent signal value is proportional to the number of amplified target genes, through the real-time monitoring of the fluorescent value in the test tube, to achieve Quantitative detection of templates...

AI Technical Summary

Problems solved by technology

[0007] 1. The temperature difference between the temperature-changing metal module and the surrounding environment will cause heat loss around the module, resulting in low temperature of the sample hole on the side of the module (especially on the corner);

[0008] 2. The power of each area of ​​the semiconductor refrigerator also has certain inhomogeneity;

[0009] 3. The sealant around the semiconductor refrigerator will also take away some heat;

[0010] 4. The temperature difference in different areas of the radiator will also cause the temperature of the variable temperature metal module to be uneven;

In the existing related improvement technology, the heat loss around the module is compensated by adding an electric heating film around the side or bottom of the temperature-changing metal module, but the heat dissipated by each sample hole of the module is uneven

Therefore, this method can only achieve rough temperature compensation, but cannot perform precise temperature compensation for each sample well

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