Array substrate and preparation method thereof
A manufacturing method and substrate technology, applied in semiconductor/solid-state device manufacturing, optics, instruments, etc., can solve problems such as cracks in transparent conductive materials
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[0027] Certain terms are used throughout the description and claims to refer to particular components. Those of ordinary skill in the art will appreciate that manufacturers may refer to the same component by different terms. This description and subsequent patent applications do not use the difference in name as a way to distinguish components, but use the difference in function of components as a basis for distinction. The "comprising" mentioned throughout the specification and subsequent claims is an open term, so it should be interpreted as "including but not limited to".
[0028] figure 1 It is a top view of an array substrate according to a preferred embodiment of the present invention. figure 2 According to the first preferred embodiment of the present invention along figure 1 The side view in the direction of the AA' section line and along the figure 1 The side view of the BB' line in the direction.
[0029] Please also see figure 1 , figure 2 , an array substr...
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