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Microfluid cooling silicon wafer level LED illuminating system

An LED lighting and silicon wafer technology, applied in the field of LED lighting systems, can solve the problems of affecting the production cost of the LED lighting system, unsatisfactory heat dissipation effect of the radiator, low integration of the lighting system, etc. The effect of saving material cost and improving heat dissipation effect

Active Publication Date: 2011-12-21
GUANGDONG REAL FAITH LIGHTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] (2) In addition, due to the unsatisfactory heat dissipation effect of existing radiators, it is difficult to meet the requirements of lighting systems with high power, especially power higher than 300W, so almost all existing LED lighting systems are based on single LED modules Design and manufacture such that the integration of the lighting system is not high
However, a single LED has low power and low brightness, so it is not suitable to be used alone. In practical applications, multiple single LED modules need to be assembled together to design a practical LED lighting system. Therefore, the number of parts of the existing LED lighting system Many, the assembly production takes a long time, the production efficiency is low, and the labor cost is high
[0007] Therefore, how to improve the heat dissipation efficiency of the LED lighting system is directly related to its integration, which in turn affects the production cost of the LED lighting system

Method used

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  • Microfluid cooling silicon wafer level LED illuminating system
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  • Microfluid cooling silicon wafer level LED illuminating system

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Experimental program
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Embodiment 1

[0046] Such as Figure 1~3 The microfluidic cooled silicon wafer-level LED lighting system shown is Embodiment 1 of the present invention, and it includes a silicon wafer substrate 1 with a plurality of gold-plated substrates on its upper surface. The LED chips 2 of the line are arranged in an m×n rectangular array, wherein m and n are integers.

[0047] Silicon wafer substrate 1 is provided with two sets of micro-cooling channels corresponding to the positions below each row of LED chips 2, and each set of micro-cooling channels is independent of each other; each set of micro-cooling channels is a micro-channel structure: including a The straight microchannel 61 directly below the LED chip 2 , and the input port 7 and the output port 8 located on the bottom surface of the silicon wafer substrate 1 .

[0048] For the convenience of processing, the silicon wafer substrate 1 is a two-layer structure in which the upper and the lower are fixedly stacked together, wherein the uppe...

Embodiment 2

[0053] Figure 4~6 The microfluidic cooled silicon wafer level LED lighting system shown is Embodiment 2 of the present invention, which differs from Embodiment 1 in that:

[0054] Below the position of the silicon wafer substrate 1 corresponding to the position of the LED chip matrix, there are two chambers arranged up and down. The two chambers are connected to form a micro-spray structure. The chamber below is the second micro-cooling passage 63, and the first and second micro-channels 62, 63 are communicated through a number of spray holes 64 provided between the two; wherein, one end of the first micro-channel 62 is connected to the Several output ports 8 on the bottom surface of the silicon wafer substrate 1 , and the end of the second microchannel 63 away from the input port 7 communicates with several input ports 7 arranged on the bottom surface of the silicon wafer substrate 1 .

[0055] For the convenience of processing, the silicon wafer substrate is a three-layer ...

Embodiment 3

[0058] Figure 7-9 The silicon wafer-level LED lighting system cooled by microfluidics shown is Embodiment 3 of the present invention, which differs from Embodiment 1 in that the conductive channel 5 for connecting each LED chip to the conductive connection pad 9 is only provided On the upper surface of the silicon wafer substrate, each LED chip is fixed on the corresponding conductive channel 5 , the phosphor layer 3 is transmitted from both ends of each conductive channel 5 , and both ends are connected with conductive connection pads.

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Abstract

The invention relates to a microfluid cooling silicon wafer level LED illuminating system which comprises a silicon wafer substrate (1), wherein the upper surface of the silicon wafer substrate (1) is provided with a plurality of LED chips (2). The microfluid cooling silicon wafer level LED illuminating system is characterized in that the silicon wafer substrate (1) is provided with a micro-cooling channel through which cooling liquid passes, and the micro-cooling channel is provided with an inlet and an outlet which are communicated with exteriors; and the position of the micro-cooling channel corresponds to the LED chips (2) arranged on the upper surface of the silicon wafer substrate (1). In the LED illuminating system of the invention, the cooling liquid channel structure is directly arranged on the silicon wafer substrate, and the LED chips are cooled by adopting the cooling liquid through the micro-cooling channel, therefore, the heat radiation effect of the LED chips is improved, the integration degree of the LED illuminating system is greatly improved, the size of an LED illuminating product is shortened, and the production cost of the LED illuminating product is greatly reduced. The invention is beneficial to the application and the popularization of the LED illuminating product.

Description

Technical field [0001] The invention relates to a silicon wafer-level LED lighting system cooled by microfluid, in particular to a rapid heat dissipation and small external size of the LED module, which can greatly improve the integration degree and production efficiency of the LED lighting system, and can reduce the cost of LED lighting. Lighting system production cost LED lighting system. Background technique [0002] Light-emitting diode (LED) is a semiconductor light-emitting device, and its light-emitting principle is to use the recombination of electrons and holes to generate photons. LED has the advantages of high luminous efficiency, good color rendering, low power consumption, energy saving and environmental protection, high safety and reliability, and long service life. As a new type of light source with low power consumption, LED has been applied in the field of lighting. [0003] Although the LED lighting system has many advantages over the traditional lighting...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/64
Inventor 刘胜毛章明罗小兵王恺
Owner GUANGDONG REAL FAITH LIGHTING TECH
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