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Conductive particle and method for producing conductive particle

A technology of conductive particles and manufacturing methods, which is applied in printed circuit manufacturing, cable/conductor manufacturing, conductive connection, etc., and can solve problems such as poor contact, reduction of conductive particles, and increased contact resistance between circuit electrodes

Inactive Publication Date: 2010-12-08
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With recent high-definition liquid crystal displays, the pitch and area of ​​bumps used as circuit electrodes for liquid crystal driving ICs have been narrowed, so the following problems arise. The conductive particles of the anisotropic conductive adhesive Adjacent circuit electrodes flow out, causing a short circuit
[0005] In addition, if the conductive particles flow out between the adjacent circuit electrodes, there will be a problem that the conductive particles in the anisotropic conductive adhesive supplemented between the bump and the glass panel will decrease, and the gap between the opposing circuit electrodes will be reduced. The contact resistance increases, causing poor contact

Method used

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  • Conductive particle and method for producing conductive particle
  • Conductive particle and method for producing conductive particle
  • Conductive particle and method for producing conductive particle

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Experimental program
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Effect test

no. 1 approach

[0090] (conductive particles)

[0091] Such as figure 1 As shown, the conductive particle 8a according to the first embodiment of the present invention is equipped with a central particle 11, and the thickness covering the central particle 11 is The above palladium layer 12 , and a plurality of insulating particles 1 arranged on the surface of the palladium layer 12 and having a particle diameter larger than the thickness of the palladium layer 12 . That is, in the conductive particle 8a, part of the surface of the mother particle 2a including the center particle 11 and the palladium layer 12 covering the center particle 11 is covered with the insulating particle 1 as a child particle.

[0092]

[0093] Preferably: the particle size of the mother particle 2a used in the present invention is smaller than the following Figure 4 The minimum spacing between the first electrode 5 and the second electrode 7. Moreover, when the height of an electrode (interval of an electrode)...

no. 2 approach

[0160] Hereinafter, the electroconductive particle and the manufacturing method of an electroconductive particle concerning 2nd Embodiment of this invention are demonstrated. In addition, only the differences between the above-mentioned first embodiment and the second embodiment will be described below, and the description of the same items in the two embodiments will be omitted.

[0161] (conductive particles)

[0162] Such as figure 2 As shown, the conductive particle 8b according to the second embodiment is different from the conductive particle 8a according to the first embodiment in that the conductive layer 13 is further provided between the core particle 11 and the palladium layer 12 .

[0163] That is, the conductive particle 8b related to the second embodiment of the present invention is equipped with a central particle 11, a conductive layer 13 covering the central particle 11, and a thickness of the conductive layer 13 covering the conductive layer 13 is ...

no. 3 approach

[0170] Hereinafter, the conductive particle and the manufacturing method of the conductive particle which concerns on 3rd Embodiment of this invention are demonstrated. In addition, only the differences between the above-mentioned first embodiment and the third embodiment will be described below, and the description of the same items in the two embodiments will be omitted.

[0171] (conductive particles)

[0172] Such as image 3 As shown, the conductive particle 8c according to the third embodiment is different from the conductive particle 8a according to the first embodiment in that the gold layer 14 covers the surface of the palladium layer 12 covering the core particle 11 .

[0173] That is, the conductive particle 8c related to the third embodiment of the present invention is provided with the central particle 11, and the thickness covering the central particle 11 is The above palladium layer 12 , the gold layer 14 covering the palladium layer 12 , and the in...

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Abstract

Disclosed is a conductive particle (8a) comprising a core particle (11), a palladium layer (12) covering the core particle (11) and having a thickness of not less than 200 AA, and an insulating particle (1) arranged on the surface of the palladium layer (12) and having a particle diameter larger than the thickness of the palladium layer (12).

Description

technical field [0001] The present invention relates to conductive particles and a method for producing conductive particles. Background technique [0002] There are two methods of mounting liquid crystal driver ICs on glass panels for liquid crystal displays: COG (Chip-on-Glass) mounting and COF (Chip-on-Flex) mounting. [0003] In COG mounting, an IC for liquid crystal driving is directly bonded to a glass panel using an anisotropic conductive adhesive containing conductive particles. On the other hand, in COF mounting, an IC for liquid crystal driving is connected to a flexible tape having metal wiring, and they are bonded to a glass panel using an anisotropic conductive adhesive containing conductive particles. The anisotropy mentioned here means conduction in the pressurized direction and insulation in the non-pressurized direction. [0004] With recent high-definition liquid crystal displays, the pitch and area of ​​bumps used as circuit electrodes for liquid crystal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/00B22F1/02H01B13/00H01R11/01B22F1/18
CPCB22F1/02H05K2201/0221C23C18/1635H01R13/03H01R4/04H05K3/323H05K2201/0224C23C18/1651B22F2998/00B22F1/18H01B5/00H01B1/02
Inventor 高井健次松泽光晴永原忧子赤井邦彦
Owner RESONAC CORPORATION
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