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Methods of treating a surface to promote binding of molecule(s) of interest, coatings and devices formed therefrom

A molecular and coating technology, used in surface pretreatment bonding methods, coatings, metal material coating processes, etc., can solve problems such as failure and poor bonding

Inactive Publication Date: 2010-09-22
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Many of these connections fail due to poor bonding between the upper metal layer and the lower metal or insulating layer
In addition, the bonding of PCB substrates (such as epoxy resin PCB substrates) to metal layers in PCB fabrication remains a major challenge for the industry

Method used

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  • Methods of treating a surface to promote binding of molecule(s) of interest, coatings and devices formed therefrom
  • Methods of treating a surface to promote binding of molecule(s) of interest, coatings and devices formed therefrom
  • Methods of treating a surface to promote binding of molecule(s) of interest, coatings and devices formed therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0163] Example 1: Molecular connection on a metal substrate

[0164] This example illustrates an exemplary method of forming an organic molecular layer on a metal substrate. In this instance, image 3 The thiol-linker molecule 16 shown in , attaches to the copper surface via the formation of a C-S-Cu bond, as Figure 1A with 2 shown. Commercial copper wafer substrates were first cleaned by sonication in acetone, water and then isopropanol for 5 minutes. The substrate was coated by spin coating with an ethanol solution containing 1 mM porphyrin molecules. The samples were then baked at 150°C for 5 minutes, followed by a solvent wash to remove residual unreacted molecules. The amount of attached molecules can be adjusted by changing the concentration of molecules, temperature and duration of ligation, and by changing the concentration of the molecules, such as Figure 4 Quantification was performed by cyclic voltammetry (CV) as shown, which is based on literature limitation...

Embodiment 2

[0165] Example 2: Molecular connection on a semiconductor substrate

[0166] This example illustrates another exemplary method of forming an organic molecular layer on a semiconductor substrate (SS): (a) Si, (b) TiN, (c) TiW, and (d) WN. In this example, hydroxyl-linker molecules 1006 are attached to the semiconductor surface via formation of C-O-SS bonds. Commercially available semiconductor wafer substrates were first cleaned by sonicating for 5 minutes in acetone, water and then isopropanol. The substrate was coated by spin coating with a benzonitrile solution containing 1 mM porphyrin molecules. The samples were then baked at 350°C for 5 minutes, followed by a solvent wash to remove residual unreacted molecules. Such as Figure 5 As shown in , the connection of the molecular layers on each substrate was also confirmed by the porphyrin CV signal peak.

Embodiment 3

[0167] Example 3: Molecular connection on semiconductor barrier substrate

[0168] This example illustrates another exemplary method for forming organic molecular layers on semiconductor barrier substrates (BS) Ta and TaN. In this example, the hydroxyl-linker molecule 258 is attached to the semiconductor surface via the formation of a C-O-BM bond. Commercially available semiconductor wafer substrates were first cleaned by sonicating for 5 minutes in acetone, water and then isopropanol. The substrate was coated by spin coating with a benzonitrile solution containing 1 mM porphyrin molecules. The samples were then baked at 350°C for 5 minutes followed by a solvent wash to remove residual unreacted molecules. In this case, the formed molecular layer cannot be characterized by CV because of the poor conductivity of the barrier substrate substrate. The molecular layers were instead characterized by laser desorption time-of-flight mass spectrometry (LDTOF). Image 6 An exemplary...

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Abstract

The present invention generally relates to methods of treating a surface of a substrate, and to the use of the method and resulting films, coatings and devices formed therefrom in various applications including but not limited to electronics manufacturing, printed circuit board manufacturing, metal electroplating, the protection of surfaces against chemical attack, the manufacture of localized conductive coatings, the manufacture of chemical sensors, for example in the fields of chemistry and molecular biology, the manufacture of biomedical equipment, and the like. In another aspect, the present invention provides a printed circuit board, a printed circuit board, comprising: at least one metal layer; a layer of organic molecules attached to the at least one metal layer; and an epoxy layeratop said layer of organic molecules.

Description

technical field [0001] The present invention relates generally to methods of treating substrate surfaces, and the use of such methods and resulting films, coatings and devices formed therefrom in various applications including, but not limited to, electronics manufacturing, printed circuit board manufacturing, metal plating, surface Uses in protection against chemical attack, production of localized conductive coatings, production of chemical sensors (for example in the fields of chemistry and molecular biology), production of biomedical devices, etc. Background technique [0002] The prior art has disclosed many techniques for chemically modifying surfaces. The manner in which molecules attach (attach) to a surface such that the molecule retains all or some of its properties on the surface is called molecular attachment. Because the molecule of interest is usually an organic or organometallic molecule, the commonly employed process relies on a very large library of organic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00C08J7/043C08J7/044C08J7/056
CPCH05K2203/121C08J7/065C23C18/1653C09J5/02C23C18/2066H05K3/181C08J7/12C23C18/1844C23C18/1893H05K3/4611H05K3/389H05K2203/1105Y02P20/582Y10T156/10C08J7/043C08J7/044C08J7/056
Inventor 维尔纳·G·库尔石志超魏任杰刘志明魏凌云
Owner ATOTECH DEUT GMBH
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