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Thermoelectric refrigeration liquid cooling device

A technology of liquid cooling and thermoelectric refrigeration, which is applied in the direction of electric solid devices, cooling/ventilation/heating transformation, circuits, etc., can solve the problems of difficult chip heat dissipation control limit temperature, lower chip operating temperature, etc., and achieve compact size and high heat exchange efficiency high effect

Inactive Publication Date: 2012-01-18
INNER MONGOLIA UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, while the heat load increases, it is required to reduce the operating temperature of the chip, making it more and more difficult to control the limit temperature of the chip heat dissipation.

Method used

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  • Thermoelectric refrigeration liquid cooling device
  • Thermoelectric refrigeration liquid cooling device
  • Thermoelectric refrigeration liquid cooling device

Examples

Experimental program
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Effect test

Embodiment 1

[0040]The thermoelectric refrigeration-liquid electronic cooler of the present invention is mainly composed of seven parts: a fan 1 for air circulation and a fan cover 2; a micro-channel refrigeration exchanger 7, a thermoelectric refrigeration module 8, a radiator 9, a hollow substrate 6 and a micro-channel Cooling plate 5. The fan 1 of the present invention is fixedly installed on the fan cover 2 by the screw 4, the fan 1 has a power cord 18, the screw 3 passes through the hole 15 on the hollow base plate 6 to fix the fan cover 2 on the hollow base plate 6, and the top of the hollow base plate 6 is fixed vertically A micro-channel refrigeration exchanger 7 is installed, and the two sides of the micro-channel refrigeration exchanger 7 are respectively symmetrically provided with a thermoelectric cooling module 8 and a radiator 9, a micro-channel refrigeration exchanger 7, a thermoelectric cooling module 8, and a radiator 9 is placed in the fan cover 2; the thermoelectric refr...

Embodiment 2

[0055] The thermoelectric refrigeration-liquid electronic cooler of the present invention is mainly composed of seven parts: a fan 1 for air circulation and a fan cover 2; a micro-channel refrigeration exchanger 7, a thermoelectric refrigeration module 8, a radiator 9, a hollow substrate 6 and a micro-channel Cooling plate 5. The fan 1 of the present invention is fixedly installed on the fan cover 2 by the screw 4. There is a power cord 18 on the fan 1. The screw 3 passes the hole 15 on the hollow base plate 6 to fix the fan cover 2 on the hollow base plate 6. The top of the hollow base plate 6 is fixedly installed. There is a micro-channel refrigeration exchanger 7, and the two sides of the micro-channel refrigeration exchanger 7 are respectively symmetrically provided with a thermoelectric cooling module 8 and a radiator 9, a micro-channel refrigeration exchanger 7, a thermoelectric cooling module 8, and a radiator 9 Placed in the fan cover 2; the thermoelectric cooling modu...

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Abstract

The invention relates to a thermoelectric refrigeration liquid cooling device, and belongs to a refrigeration plant. Thermoelectric refrigeration films and radiators are symmetrically arranged on two sides of a micro channel refrigeration exchanger; the micro channel refrigeration exchanger and a micro channel cooling plate are respectively arranged on the top and bottom of a hollow substrate; the micro channel refrigeration exchanger is provided with a liquid inlet and a liquid outlet which are connected by a hose; a water pump is arranged on the hose; two side walls of the micro channel refrigeration exchanger are symmetrically provided with micro channels; a plurality of micro channels are formed parallelly on the micro channel cooling plate; upper and lower runner division plates are arranged among the micro channels; and the micro channels on the micro channel refrigeration exchanger are communicated with those on the micro channel cooling plate. The thermoelectric refrigeration liquid cooling device can be used for ultralow temperature radiating and cooling of microelectronics and power electronics, has the advantages of large heat capacity and quick cooling by combining theadvanced water cooling technology and thermoelectric refrigeration, and can adjust cooling temperature freely to realize the cooling to a temperature lower than ambient temperature.

Description

Technical field: [0001] The invention relates to a thermal-electric cooling liquid cooling device, which is used for ultra-low temperature cooling of microelectronic chips, electronic components, power electronic equipment, computers, laser devices, LEDs, and military equipment, and belongs to refrigeration equipment. technical background [0002] The development of microelectronics technology makes it possible for users to reduce the size of the device while seeking to increase the computing speed. This development trend makes the density of transistors and circuits per unit area of ​​the chip higher and higher, resulting in a substantial increase in the total heat load and heat flux density on the chip. How to effectively export heat and control the core temperature is a key factor restricting the development of chips, and it is also the key to stable and reliable performance of equipment, because the main reason for the performance degradation or even destruction of elect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/38G06F1/20
Inventor 王亚雄赫文秀郭贵宝崔永亮
Owner INNER MONGOLIA UNIV OF SCI & TECH
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