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Process for production of polyimide film, and polyamic acid solution composition

A technology of polyimide film and manufacturing method, which is applied in the direction of coating, etc., and can solve the problems of foaming, poor formability, difficulty in making polyimide film, etc.

Active Publication Date: 2010-08-11
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the coating film formed by coating the polyamic acid solution composition mainly composed of s-BPDA and PPD on the substrate is subjected to heat treatment, a thicker polyimide film is obtained. In the case of a film, there is a problem that foaming is likely to occur during the heat treatment, making it difficult to produce a good polyimide film, etc. The film forming property (formability) is poor

Method used

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  • Process for production of polyimide film, and polyamic acid solution composition
  • Process for production of polyimide film, and polyamic acid solution composition
  • Process for production of polyimide film, and polyamic acid solution composition

Examples

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preparation example Construction

[0023] The preparation of polyamic acid can preferably adopt the known method or condition for preparing polyamic acid. Therefore, it is not particularly limited, but it is preferable to stir for 0.1 hour to several tens of hours under the temperature conditions for suppressing the imidization of the amide bond and the carboxyl group of the polyamic acid, preferably below 100°C, more preferably below 80°C. For example, tetracarboxylic dianhydride and diamine are reacted in an organic solvent at a concentration of about 5 to 50% by mass in terms of polyimide solid content, thereby obtaining a uniform polyamic acid solution. When the solid content concentration in terms of polyimide is less than 5% by mass, it is uneconomical because a large amount of solvent is used, and when the solid content concentration exceeds 50% by mass, the viscosity tends to become high, making handling difficult.

[0024] As the organic solvent used for the preparation of the polyamic acid, convention...

Embodiment 1

[0073] Add NMP 300g (accounting for 75% by mass in the total amount of solvent), NEP 100g (accounting for 25% by mass in the total amount of solvent) as a solvent in a glass reaction vessel with an inner volume of 500ml with a stirrer and a nitrogen gas introduction and discharge pipe. %), PPD 26.88g (0.249 mol) and s-BPDA73.12g (0.249 mol) were added thereto, and stirred at 50°C for 10 hours to obtain a solid content concentration of 18.5% by weight and a solution viscosity of 55.0 Pa·s. A polyamic acid solution composition with a numerical viscosity of 1.00.

[0074] The polyamic acid solution composition is coated on the glass plate of the base material by using a bar coater, and the coating film is degassed and pre-dried for 30 minutes at 25° C. under reduced pressure, and then under normal pressure and nitrogen environment Put it in a hot air dryer, heat treatment at 120°C for 60 minutes, 150°C for 30 minutes, 200°C for 10 minutes, 250°C for 10 minutes, and 400°C for 10 m...

Embodiment 2

[0077] A polyimide film having a film thickness of 50 μm was formed in the same manner as in Example 1 except for using 200 g of NMP (50 mass % in the total solvent) and 200 g of NEP (50 mass % in the total solvent).

[0078] Table 1 shows the results of properties and the like of the polyimide film.

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Abstract

Disclosed is a process for producing a polyimide film, which comprises applying a polyamic acid solution composition to a base material to form a coating film, and subsequently heating the coating film, wherein the polyamic acid solution composition comprises a mixed solvent of two or more solvents selected from N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone and 1,3-dimethyl-2-imidazolidinone (wherein each of the solvents is contained in an amount of 7 to 93 mass% relative to 100 mass% of the total amount of the solvents) and a polyamic acid mainly composed of s-BPDA and PPD. The process enables to produce a polyimide film having a film thickness of more than 40 [mu]m without the need of expanding the film.

Description

technical field [0001] The present invention relates to the easy manufacture of aromatic polymers composed of a specific chemical structure, having extremely high tensile strength, tensile elastic modulus and tear strength, and having a large (thicker) film thickness without foaming. A method for producing a polyimide film of an imide film, and a polyamic acid solution composition used in the method for producing the polyimide film. Background technique [0002] Aromatic polyimides are preferably used in electrical and electronic components and the like because they are excellent in properties such as heat resistance, chemical resistance, electrical properties, and mechanical strength. Among them, as described in Patent Document 1, 3,3',4,4'-biphenyltetracarboxylic dianhydride (hereinafter sometimes abbreviated as "s-BPDA") and p-phenylenediamine (hereinafter sometimes abbreviated Aromatic polyimide, which is described as "PPD") as the main component, is particularly excell...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18B29C41/04C08L79/04
CPCC08J5/18C08J2379/08C08G73/1032B29C41/042C09D179/08C08G73/1067C08G73/10
Inventor 中山刚成高林诚一郎村上彻
Owner UBE IND LTD
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