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Adhesive composition, adhesive sheet, dicing die attach film and semiconductor device

A composition and adhesive technology, applied in the direction of amide/imide polymer adhesives, semiconductor devices, ester copolymer adhesives, etc., can solve the difficulty of ensuring the stability of dicing-die adhesive film storage It can solve the problems of stability, melt viscosity increase rate, elastic modulus increase, and semiconductor device reliability deterioration, etc., to achieve the effects of excellent characteristic stability, low elastic modulus, and excellent heat resistance.

Inactive Publication Date: 2010-08-11
SHIN ETSU CHEM IND CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, after the dicing-die bonding film is produced, the characteristics (adhesiveness, embedding performance) of the adhesive film will change with time, and if the dicing-die bonding film is stored for a long time When used in the manufacture of semiconductor devices, the reliability of the obtained semiconductor devices will deteriorate, so it is difficult to ensure the storage stability of the dicing-die bonding film in the manufacturing process of semiconductor devices
[0009] In addition, for an adhesive film made of an adhesive containing epoxy resin, due to the presence of epoxy resin, heating in the wire bonding process will cause an increase in the rate of increase in melt viscosity and an increase in elastic modulus. Therefore, it is sometimes difficult to remove voids during the resin sealing process

Method used

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  • Adhesive composition, adhesive sheet, dicing die attach film and semiconductor device
  • Adhesive composition, adhesive sheet, dicing die attach film and semiconductor device
  • Adhesive composition, adhesive sheet, dicing die attach film and semiconductor device

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Embodiment

[0115] Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited to these examples.

[0116] [Preparation of Adhesive Composition]

[0117] According to the mixing amount (parts by mass) shown in Table 1, feed the following components (A) to (C) and other components into a mixer (manufactured by Thinky Co., Ltd.) of the rotation / revolution system, and further add A Ethyl ketone, toluene, or cyclohexanone were mixed so that the total concentration of the above-mentioned (A) to (C) components and other components became 20% by mass, and an adhesive composition was prepared.

[0118] (A) component (meth)acrylic resin

[0119] ・SG-P3LC-43: a (meth)acrylic resin (manufactured by Nagasechemtex Co.), which has an epoxy group and further has a structural unit derived from acrylonitrile represented by the above formula (1), and contains 0.027 mol / 100 g of ring Oxygen, Tg=8°C, weigh...

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Abstract

The invention provides an adhesive composition. The adhesive composition contains a component (A), a component (B) and a component (C), wherein the component (A) contains an epoxy group, a structural unit from acrylonitrile, and (methyl) acrylic resin with weight-average molecular weight of 50,000 to 1,500,000; the component (B) contains epoxy resin with a dicyclopentadiene skeleton structure; and the component (C) contains aromatic polyamide with a diphenyl sulfone skeleton structure. In addition, the invention also provides an adhesive sheet using the adhesive composition, a dicing die attach film using the adhesive composition and having excellent property stability and pickup stability, and a semiconductor device obtained by using the adhesive sheet or the dicing die attach film. The adhesive composition has excellent adhesive property, shows excellent embedded performance, and can provide a high-reliability semiconductor device when being used for manufacturing the semiconductor device.

Description

technical field [0001] The present invention relates to an adhesive composition, an adhesive sheet and a dicing-die bonding film using the adhesive composition, and the adhesive sheet or the dicing-die bonding film using the adhesive composition In the obtained semiconductor device, the adhesive composition includes (meth)acrylic resin, epoxy resin and aromatic polyamine (polyamine, polyamine), and when the semiconductor chip is bonded on the substrate, the The adhesive composition can reduce void generation. Background technique [0002] This conductor device can be manufactured by the following methods: (i) cutting a large-diameter silicon wafer on which an IC circuit is formed into semiconductor chips through a dicing (cutting) process; (ii) using a curable liquid adhesive as a die-bonding material The chip is thermocompressed on the lead frame with an agent, etc., and the adhesive is cured to fix (mount) the chip; (iii) perform wire bonding between electrodes; then, (iv...

Claims

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Application Information

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IPC IPC(8): C09J133/02C09J133/08C09J133/10C09J133/14C09J133/20C09J133/26C09J163/08C09J179/02C09J7/02B32B7/12H01L29/00H01L23/00
CPCB23K26/402B26D7/1863D06H7/221
Inventor 小内谕小堺正平
Owner SHIN ETSU CHEM IND CO LTD
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