Gallium doping method of Czochralski silicon monocrystalline and doping device thereof
An element doping, polysilicon technology, applied in diffusion/doping, chemical instruments and methods, crystal growth, etc., can solve the problems of prolonged crystal pulling time, high equipment requirements, poor economic benefits, etc., and increase process costs. , the effect of reducing costs and reducing risks
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Embodiment 1
[0037] Embodiment 1, a kind of gallium element doping device, comprises the hanger 2 that is made of high-purity quartz and the annular fixing sleeve 3 and the hollow cone 4 that is caused by high-purity monocrystalline silicon; Outside the hollow cone 4 An annular groove is arranged on the surface, and the annular fixing sleeve 3 is stuck in the above-mentioned annular groove; thus, the hollow cone 4 is fixedly connected with the annular fixing sleeve 3 . The upper end of the suspension ring 2 is fixedly connected with the handle 1, and the lower end of the suspension ring 2 is fixedly connected with the annular fixed sleeve 3; the handle 1 is provided with a groove 11 matched with the seed chuck on the seed crystal rod.
[0038] The wall thickness of the cone tip of the hollow cone 4 (that is, from the cone top 41 to the distance from the cone top 41 to a height of 30mm) is 1mm, and the wall thickness of the remaining parts is 5mm; the taper is about 45 degrees.
Embodiment 2
[0039] Embodiment 2, the gallium element doping method of the Czochralski silicon single crystal carried out using the gallium element doping device described in embodiment 1, the following steps are carried out in sequence:
[0040] 1), at a room temperature of 25°C, weigh 290mg of gallium, and put 290mg of gallium into the inner cavity of the hollow cone 4 of the gallium element doping device;
[0041] 2) Place the quartz crucible in the hearth of the single crystal furnace, put 60kg of polysilicon into the quartz crucible, close the furnace cover, and raise the temperature to 1420°C to melt the polysilicon to a liquid state;
[0042]3), open the furnace door of the auxiliary chamber of the single crystal furnace, put the gallium element doping device obtained in step 1) into the auxiliary chamber, and fix the groove 11 with the seed crystal chuck in the auxiliary chamber; keep the polysilicon in this step is liquid;
[0043] 4), close the furnace door of the auxiliary cham...
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