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Grinding liquid for wire sawing

A technology of grinding liquid and wire saw, which is applied in the field of grinding liquid, can solve the problems of poor quality of GaAs wafers and achieve the effect of simple price

Active Publication Date: 2014-04-30
FREIBERGER COMPOUND MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] A disadvantage of the method known to the applicant is that the change in the properties of the slurry with the increasing duration of use causes at the same time a poor quality of the GaAs wafers produced in this way

Method used

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  • Grinding liquid for wire sawing
  • Grinding liquid for wire sawing
  • Grinding liquid for wire sawing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] figure 1 A first exemplary embodiment of a wire saw 1 according to the invention is shown.

[0039] The wire saw 1 has several wire guide rollers 2 arranged parallel to each other, and the wire is guided multiple times around said guide rollers 2 in order to tighten a wire area E comprising several parallel wire segments perpendicular to figure 1 The plane of the paper. A feed device 4 is also provided, on which the workpiece 5 can be fixed with a saw blade 6 . The workpiece 5 fixed thereon can be moved through the wire area E in a direction perpendicular to the wire area E by means of the feed device 4 . The wire guide roller 2 is connected to a rotating device, not shown, which rotates the wire guide roller 2 in order to move the wire along its longitudinal axis.

[0040] Two abrasive liquid nozzles 7 are arranged above the steel wire plane, and the abrasive liquid can be coated on the steel wire area E through the nozzles 7 . In this case, the abrasive liquid noz...

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Abstract

The wire saw (1) has a wire (3) and a slurry application device (7). The saw also has a device (21, 22) to set a preset water content for a gas surrounding at least part of the slurry. Part of the wire saw may be climatically separable from the surrounding gas so that the water content in this part can be set independently of the water content in the rest of the gas.

Description

[0001] This divisional application is a divisional application based on the Chinese patent application No. 200610115095.7, the filing date is August 24, 2006, and the invention title is "Method, Equipment and Grinding Liquid for Wire Sawing". technical field [0002] The present invention relates to abrasive slurries for use in wire saws. Background technique [0003] EP 0837115 B1 discloses a method for cutting crystals made of hard and brittle materials into wafers using a wire saw, in which method a medium in the form of a suspension is used. The medium mainly includes a non-aqueous liquid, and the hard material particles with grinding effect are dispersed in the above-mentioned non-aqueous liquid. The non-aqueous solution is selected from a group of compounds comprising polyethylene glycol having a molecular weight of 75-150 and any desired mixtures of such compounds, and containing up to 5% by weight of the suspension (according to by weight) of water. The viscosity o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K3/14
CPCB28D5/007B28D5/045Y02P70/10
Inventor R·哈默A·科莱因韦希特S·米勒R·格鲁辛斯基
Owner FREIBERGER COMPOUND MATERIALS
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