Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Silicon-containing compound, curable composition and cured product

A technology of curable composition and silicon compound, applied in the field of silicon-containing compound, curable composition and cured product, can solve the problem that curing characteristics may not be sufficient and cured product cannot be obtained

Inactive Publication Date: 2010-02-24
ADEKA CORP
View PDF1 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curing properties of this silicon-containing curable composition are not necessarily sufficient, and there is a problem that a cured product having sufficient performance cannot be obtained at a low temperature and in a short time.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon-containing compound, curable composition and cured product
  • Silicon-containing compound, curable composition and cured product
  • Silicon-containing compound, curable composition and cured product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0079] Hereinafter, the present invention will be described in more detail with examples and the like, but the present invention is not limited to these examples and the like. In addition, "part" and "%" in an Example are based on mass.

Synthetic example 1

[0081] Mix 90 parts of dichlorodimethylsilane and 9 parts of dichlorodiphenylsilane, and add dropwise to a mixture of 100 parts of ion-exchanged water, 50 parts of toluene and 450 parts of 48% aqueous sodium hydroxide solution at 105 Polymerization was carried out at °C for 5 hours. After washing the obtained reaction solution with 500 parts of ion-exchanged water, the toluene solution was dehydrated, 20 parts of pyridine was added, and 20 parts of dimethylvinylchlorosilane was added thereto, followed by stirring at 70° C. for 30 minutes. Then, after washing with 100 parts of ion-exchanged water, the solvent was distilled off under reduced pressure at 150°C. Next, after washing with 100 parts of acetonitrile, the solvent was distilled off under reduced pressure at 70° C. to obtain an acyclic polysiloxane compound (a1-1) having an unsaturated bond. As a result of analysis by GPC under the following conditions, the molecular weight Mw of the acyclic polysiloxane compound (a1-1)...

Embodiment 1

[0086] Dissolve 100 parts of the acyclic polysiloxane compound (a1-1) having an unsaturated bond obtained in Synthesis Example 1 in 200 parts of toluene, add 0.003 parts of a platinum catalyst, and as a cyclic polysiloxane compound 10 parts of 1,3,5,7-tetramethylcyclotetrasiloxane were reacted at 105°C for 2 hours. After the solvent was distilled under reduced pressure at 70°C, it was washed with 100 parts of acetonitrile. Then, the solvent was distilled under reduced pressure at 70°C to obtain a silicon-containing compound (A-1). As a result of analysis by GPC, the molecular weight Mw of the silicon-containing compound (A-1) was 22,000.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

Disclosed is a silicon-containing compound represented by the general formula (1) below. Also disclosed is a curable composition containing a silicon-containing compound represented by the general formula (1) below wherein Z is a hydrogen atom, a silicon-containing compound represented by the general formula (1) below wherein Z is a C2-4 alkenyl or alkynyl group, and a hydrosilylation catalyst. This curable composition is excellent in handling properties and curability, and enables to obtain a cured product having excellent heat resistance and flexibility. (In the formula, R-R<g> each represents a C1-12 saturated aliphatic hydrocarbon group or a C6-12 aromatic hydrocarbon group (provided that R<e> and R<f> are not C1-12 saturated aliphatic hydrocarbon groups at the same time); Y represents a C2-4 alkylene group; Z represents a hydrogen atom or a C2-4 alkenyl or alkynyl group; K represents a number of 2-7; T represents a number of 1-7; P represents a number of 0-3; and M and N represent numbers satisfying the following relation: N:M = 1:1-1:100, with the total of all M's and all N's being not less than 15, which make the mass average molecular weight of the compound to be 3,000-1,000,000).

Description

technical field [0001] The present invention relates to a novel silicon-containing compound having a specific structure, a curable composition containing the compound, and a cured product obtained by thermally curing the composition. A silicon-containing compound of a curable composition forming a cured product excellent in heat resistance and flexibility, a curable composition containing the silicon-containing compound, and a cured product excellent in heat resistance and flexibility. Background technique [0002] Composite materials that combine organic and inorganic materials have been studied in various ways, and the method of compounding inorganic fillers in organic polymers or coating the metal surface with organic polymers is also used in industry. method etc. Since these organic-inorganic composite materials have a size above the micron order, although some physical properties can be improved unexpectedly, many other performances and physical properties simply show ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/50C08K3/20C08K3/36C08L83/05C08L83/07C08L83/14
CPCC08L83/14C08G77/50C08L83/00C08K3/22C08K3/36C08K2003/2227C08K2003/2237C08K2003/2296
Inventor 末吉孝日渡谦一郎谢名堂正东海林义和斋藤诚一菅原良孝
Owner ADEKA CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com