Process for encapsulating light-emitting diode

A technology of light-emitting diodes and packaging technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems affecting the consistency of light color, inconsistent spacing, yellow circles in the light spot, etc., to improve the consistency and stability of light color, Remove the effect of the aperture

Inactive Publication Date: 2010-02-24
SICHUAN JIUZHOU OPTOELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the divergence of light, making it far away from the chip 2 area ( figure 1 The distance between the phosphor powder at position A) and the chip is inconsistent, and the attenuation of light makes the phosphor powder at position A not fully excited by blue light, resulting in a yellow circle formed by the light emitted by the light-emitting diode. Sometimes there will be a yellow circle in the projected light spot, which will affect the light color consistency of the whole light

Method used

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  • Process for encapsulating light-emitting diode
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  • Process for encapsulating light-emitting diode

Examples

Experimental program
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Effect test

Embodiment 1

[0028] The LED packaging process of this embodiment includes the following process steps:

[0029] (1) Die-bonding: expand the core of the chip to make it meet the production requirements, bond the chip 2 to the heat-conducting base 1 of the bracket body 5 with crystal-bonding glue, and dry and solidify at a temperature of about 150°C;

[0030] (2) Welding wire: weld the two ends of the gold wire 3 on the electrode pin 6 and the chip 2 respectively, and electrically connect the chip 2 to the electrode pin 6;

[0031] (3) Glue dispensing: apply fluorescent powder glue 4 above the chip 2;

[0032] (4) Precipitation: After dispensing, let stand at 90° C. for 30 minutes to allow the phosphor to precipitate naturally, forming a phosphor layer 7 above the chip 2 ;

[0033] (5) Curing: curing the fluorescent powder glue at a temperature of 150°C;

[0034] (6) Encapsulation: Dot silica gel on the fluorescent powder glue, and cure it at a temperature of 150°C to complete the encapsul...

Embodiment 2

[0039] The LED packaging process of this embodiment includes the following process steps:

[0040] (1) Die-bonding: expand the core of the chip to make it meet the production requirements, bond the chip 2 to the heat-conducting base 1 of the bracket body 5 with crystal-bonding glue, and dry and solidify at a temperature of about 150°C;

[0041] (2) Welding wire: weld the two ends of the gold wire 3 on the electrode pin 6 and the chip 2 respectively, and electrically connect the chip 2 to the electrode pin 6;

[0042] (3) Glue dispensing: dot the fluorescent powder 4 above the chip 2;

[0043] (4) Precipitation: After dispensing, let stand at 30° C. for 4 hours to allow the phosphor to precipitate naturally, forming a phosphor layer 7 above the chip 2 ;

[0044] (5) Curing: curing the fluorescent powder glue at a temperature of 80°C;

[0045] (6) Encapsulation: Dot silica gel on the fluorescent powder glue, and cure it at a temperature of 150°C to complete the encapsulation o...

Embodiment 3

[0050] The LED packaging process of this embodiment includes the following process steps:

[0051] (1) Die-bonding: expand the core of the chip to meet the production requirements, bond the chip 2 to the heat-conducting base 1 of the bracket body 5 with a die-bonding glue, and dry and solidify at a temperature of about 150°C;

[0052] (2) Welding wire: weld the two ends of the gold wire 3 on the electrode pin 6 and the chip 2 respectively, and electrically connect the chip 2 to the electrode pin 6;

[0053] (3) Glue dispensing: apply fluorescent powder glue 4 above the chip 2;

[0054] (4) Precipitation: After dispensing, let stand at 90° C. for 120 minutes to allow the phosphor to precipitate naturally and form a phosphor layer 7 above the chip 2 ;

[0055] (5) Curing: curing the fluorescent powder glue at a temperature of 80°C;

[0056] (6) Encapsulation: Dot silica gel on the fluorescent powder glue, and cure it at a temperature of 150°C to complete the encapsulation of t...

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Abstract

The invention relates to the technical field of light-emitting diodes, in particular to a process for encapsulating a high-power light-emitting diode. The process for encapsulating a light-emitting diode comprises the following steps: applying glue and then keeping a light-emitting diode static at normal temperature to 102 DEG C for a period of time; depositing fluorescent powder in glue and leading the fluorescent powder to be attached to the surface of a chip. The invention eliminates a yellow aperture formed after the light-emitting diode is projected. Colors of light spots projected by thelight-emitting diode are consistent and even, and the light color quality of the light-emitting diode is improved.

Description

technical field [0001] The invention relates to the technical field of light-emitting diodes, in particular to a packaging process for high-power light-emitting diodes. Background technique [0002] Light Emitting Diode (LED) is a light-emitting element made of semiconductor materials, which can convert electrical energy into light energy, and has the characteristics of power saving, energy saving, environmental protection, and long service life. colored target. [0003] The light-emitting diode emits light by using a blue light chip to irradiate fluorescent substances to excite the fluorescent substances to produce yellow light complementary to the blue light, and then use the lens principle to mix the complementary yellow light and blue light to obtain white light visible to the naked eye. The fluorescent powder of the light-emitting diode is mixed with resin and other glue-like substances and then coated on the top of the blue light chip. A typical structure of a light ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
Inventor 任恒
Owner SICHUAN JIUZHOU OPTOELECTRONIC TECH CO LTD
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