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Precise polishing method of stainless steel substrate

A precision polishing and stainless steel technology, which is applied to polishing compositions containing abrasives, grinding/polishing equipment, surface polishing machine tools, etc., can solve problems such as no related reports, and achieve smooth and smooth surfaces

Active Publication Date: 2010-02-10
SHANGHAI XINANNA ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no relevant report on the application of chemical mechanical polishing method to the preparation of flexible metal substrate materials for thin film transistors.

Method used

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  • Precise polishing method of stainless steel substrate
  • Precise polishing method of stainless steel substrate
  • Precise polishing method of stainless steel substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] (1) Preparation of polishing liquid

[0034] Silicon oxide particles: 10wt%; oxidizing agent Fe(NO 3 ) 3 : 5wt%; inhibitor BTA: 0.2wt%; complexing agent glycerol: 0.5wt%; pH regulator CH 3 COOH: 0.2wt%; the rest is water;

[0035] (2) The stainless steel substrate 5 to be polished is fixed on the bottom of the polishing head 4, and the polishing head 4 is acted on the polishing table 6 by the pressurizing device 7, and the polishing table 6 and the polishing head 4 rotate under the drive of the rotating device, and polish simultaneously The liquid 2 is transported to the surface of the polishing pad 1, so that the polishing liquid 2, the polishing pad 1 and the stainless steel substrate 5 are in full contact;

[0036] Polishing process parameters: the speed of the polishing table 6 is 40-200 rpm; the speed of the polishing head 4 is 40-200 rpm, and the speed of the polishing head 4 and the polishing table 6 are approximately equal; the stainless steel substrate 5 act...

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Abstract

The invention relates to a precise polishing method of a stainless steel substrate, comprising the following steps: preparing polishing solution in proportion; fixing the steel substrate 5 to be polished stainless at the bottom of a polishing head 4, allowing the polishing head 4 to act on a polishing block 6 by a pressure device 7, driving the polishing block 6 and the polishing head 4 to rotatewith the help of a rotating device, and transporting solution 2 to the surface of a polishing pad 1 to ensure the polishing solution 2, the polishing pad 1 and the stainless steel substrate 5 can contact with each other fully; carrying out chemical mechanical polishing on the surface of stainless steel substrate 5 till the surface becomes a complete mirror face; and then cleaning the surface of the stainless steel substrate 5 at once. The surface of the stainless steel substrate polished by the method provided in the invention is neat and smooth and the roughness concentration of root mean square is only 0.7 nano, thereby overcoming the problem that other polishing methods are unable to meet the requirements of flatness and roughness concentration.

Description

technical field [0001] The invention belongs to the field of polishing of flexible semiconductor device substrates, in particular to a precision polishing method for stainless steel substrates. Background technique [0002] With the improvement of modern living standards, the public's demand for electronic products is becoming more and more diverse, and the products are required to be small, light, and multi-functional. Thin-film transistors (TFTs) are working units for realizing the functions of various digital products. Display screens of electronic products currently on the market, such as mobile phones, notebook computers, and liquid crystal displays, all have a flat appearance and are developing towards thinning. Due to the use of rigid substrate substrates, such as glass substrates or silicon substrates, in the manufacture of displays, flat panel displays have poor flexibility and cannot or are difficult to bend; most rigid substrates are brittle materials. , the dis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02C09G1/02C09K3/14H01L21/02
Inventor 胡晓凯宋志棠刘卫丽
Owner SHANGHAI XINANNA ELECTRONICS TECH
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