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Analyzer, analysis method, and analysis program

An analysis device, analysis method technology, applied in the field of analysis program, capable of solving problems such as difficulty in sufficiently suppressing bending

Inactive Publication Date: 2010-02-03
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult to sufficiently suppress warping that occurs during mounting

Method used

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  • Analyzer, analysis method, and analysis program
  • Analyzer, analysis method, and analysis program
  • Analyzer, analysis method, and analysis program

Examples

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Embodiment Construction

[0034] Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. A structure analysis device according to an embodiment of the present invention is a device for performing structure analysis on a printed wiring board or the like. That is, the object to be analyzed by the structure analysis device (analyzed object) is a printed wiring board or the like.

[0035] First, the analysis object will be described. figure 1 It is a diagram showing an example of an analysis object of the structure analysis device according to the embodiment of the present invention.

[0036] In this example, the object to be analyzed includes a printed circuit board 1 and a frame 2 surrounding the printed circuit board 1 . There is a separation groove 3 between the printed wiring board 1 and the frame 2 , and ribs 4 for connecting the printed wiring board 1 and the frame 2 are provided in multiple places in the separation groove 3 . By cutting th...

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Abstract

A first generation portion divides an object to be analyzed into a plurality of finite elements to generate element division data. A first calculation portion defines and calculates a plurality of meshes dividing the object to be analyzed into units larger than the finite elements. A second generation portion assumes that a friction layer which has a thickness of '0' and a friction coefficient between a conductive material and a composite material of a predetermined value less than 1 exists at the interface between the conductive material and the composite material, and the second generation portion generates mesh data. A second calculation portion uses various solvers to calculate the physical amounts produced in the object to be analyzed on the basis of the mesh data and outputs the analysis result. In other words, the second calculation portion performs a simulation of the behavior of the object to be analyzed. The simulation is performed within an arbitrary temperature range set by a user.

Description

technical field [0001] The present invention relates to an analysis device, an analysis method and an analysis program for analyzing the structure of an object to be analyzed using the finite element method. Background technique [0002] A printed wiring board on which an integrated circuit pattern is formed using a mask technique is used for a mother board of an electronic device, etc. Such a mask technique is disclosed in Patent Document 1 and the like. [0003] However, in a reflow process for mounting electronic components (for example, LSI: Large Scale Integration (Large Scale Integration)) on a printed wiring board, warping may occur on the printed wiring board depending on the temperature conditions. When such a warp occurs, a non-contact, a short circuit, and the like may occur at a bump-bonding portion of an electronic component, etc., resulting in a decrease in product yield. [0004] Therefore, the following technology has been conceived: Combining a computer-ai...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50H05K3/00H05K3/34G06F19/00
CPCH05K3/0005G06F2217/16G06F2217/44H05K3/30G06F17/5018H05K3/00H05K1/0271G06F2217/80G06F30/23G06F2111/10G06F2113/26G06F2119/08
Inventor 水谷大辅伊东伸孝
Owner FUJITSU LTD
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