Preparation method of filled-type thermally conductive silicone rubber composite material

Abstract

The invention discloses a preparation method of a filled-type thermally conductive silicone rubber composite material. The processing steps of the method are as follows: 1) using alcohol solution to mix carbon-encapsulated copper nanoparticles evenly, and then drying the nanoparticles to prepare dry powder; 2) adding the raw silicone rubber onto a roller, after the raw rubber covers the roller, adding carbon-encapsulated copper nanoparticles dry powder and hydroxy silicone oil in sequence in accordance with the formulation design amounts; mixing the dry powder and the hydroxy silicone oil on the roller repeatedly until being uniform, then adding a vulcanizing agent, and then mixing the mixture uniformly, thin-passing a lower sheet to obtain the silicon rubber compound; 3) putting mixed silicone rubber into a mold, carrying out first vulcanization after cold pressing and mold filling; 4) putting a vulcanization-molded sample on a glass cloth and carrying out post vulcanization on the sample in an air dry oven to obtain finished products. The invention mixes the carbon-encapsulated copper nanoparticles and high-temperature silicone rubber to ensure that the carbon-encapsulated copper nanoparticles are evenly scattered in the silicone rubber substrate to form an integral thermally conductive network chain, thereby improving the thermal conductivity of the silicone rubber.

Description

technical field [0001] The invention relates to a preparation method of a high thermal conductivity composite material, in particular to a preparation process of a high thermal conductivity filled silicone rubber composite material suitable for potting and packaging of electronic components. Background technique [0002] With the development of science and technology, electronic devices are becoming more and more dense and miniaturized, which puts forward higher requirements for the stability of electronic devices. In order to prevent the intrusion of moisture, dust and harmful gases to electronic components, slow down vibration, prevent external force and stabilize components. To minimize the adverse effects of the outside world, electronic components need to be potted and installed. Since the miniaturization of electronic devices has resulted in high power per unit area, if the heat generated by electronic devices cannot be dissipated immediately, it is easy to form a loc...

AI Technical Summary

Problems solved by technology

[0006] In order to overcome many deficiencies in existing high thermal conductivity composite materials such as small thermal conductivity, large thermal expansion coefficient, and poor effect of stabilizing components, the invention provides a method for preparing a filled thermally conductive silicone rubber composite material. The product can effectively realize the high-efficiency transfer of heat, significantly improve the thermal conductivity of the composite material, reduce the thermal expansion coefficient of the composite material, stabilize the components, and more effectively prevent the intrusion of moisture, dust and harmful gases to the electronic components , while reducing production costs