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Sn-Ag-Cu lead-free solder containing Nd, Li, As and In

A lead-free solder, sn-ag-cu technology, applied in the direction of welding/cutting media/materials, welding media, metal processing equipment, etc., can solve the problem of very limited improvement of the comprehensive performance of solder alloys

Active Publication Date: 2009-11-18
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

By adding a small amount of Ni (helps to improve the thermal fatigue resistance of the solder joint) and Ge (increases wettability and reduces the formation of slag) in SnAgCu at the same time, the reliability of the solder joint is improved, but for the solder alloy The improvement of the overall performance of the solder alloy is very limited. The addition of trace rare earth La or Ce can improve the wetting performance of the solder, and can also greatly improve the creep resistance and mechanical properties of the solder alloy, which can significantly improve the Sn-Ag-Cu system. The overall performance of solder alloys, but there are still deficiencies

Method used

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  • Sn-Ag-Cu lead-free solder containing Nd, Li, As and In
  • Sn-Ag-Cu lead-free solder containing Nd, Li, As and In

Examples

Experimental program
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Effect test

Embodiment 1

[0029] A kind of Sn-Ag-Cu lead-free solder containing Nd, Li, As, In, proportioned by mass fraction, its composition is: 3.7% Ag, 0.7% Cu, 0.001% Nd, 0.05% Li, 0.05% As , 0.08% In, 0.05% Pb, and the balance is Sn. The solidus temperature of the "Sn-Ag-Cu lead-free solder containing Nd, Li, As, and In" obtained by the above composition ratio is about 213°C, and the liquidus temperature is about 218°C (considering the experimental error), Combined with commercially available no-clean flux, it has excellent wettability and spreadability on copper and PCB boards.

Embodiment 2

[0031] A kind of Sn-Ag-Cu lead-free solder containing Nd, Li, As, In, proportioned by mass fraction, its composition is: 3.6% Ag, 0.9% Cu, 0.025% Nd, 0.03% Li, 0.05% As , 0.1% In, 0.02% Pb, and the balance is Sn. The solidus temperature of the "Sn-Ag-Cu lead-free solder containing Nd, Li, As, and In" obtained by the above composition ratio is about 212°C, and the liquidus temperature is about 217°C (considering the experimental error), Combined with commercially available no-clean flux, it has excellent wettability and spreadability on copper and PCB boards.

Embodiment 3

[0033] A kind of Sn-Ag-Cu lead-free solder containing Nd, Li, As, In, proportioned by mass fraction, its composition is: 3.4% Ag, 0.5% Cu, 0.05% Nd, 0.02% Li, 0.05% As , 0.001% In, 0.001% Pb, and the balance is Sn. The solidus temperature of the "Sn-Ag-Cu lead-free solder containing Nd, Li, As, and In" obtained by the above composition ratio is about 212°C, and the liquidus temperature is about 216°C (considering the experimental error), Combined with commercially available no-clean flux, it has excellent wettability and spreadability on copper and PCB boards.

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Abstract

The invention relates to a Sn-Ag-Cu lead-free solder containing Nd, Li, As and In, and belongs to soldering materials of metal materials. The solder comprises the following chemical compositions by mass percentage: 0.5 to 4.5 percent of Ag, 0.2 to 1.5 percent of Cu, 0.001 to 0.5 percent of Nd, 0.001 to 0.1 percent of Li, 0.001 to 0.1 percent of As, 0.001 to 0.1 percent of In, 0.001 to 0.1 percent of Pb, and the balance of Sn. The solder has excellent soldering performance (mainly including the wettability), and excellent mechanical property and creep resistant property, and is applicable to wave soldering, reflow soldering and other welding methods in the electronic industry.

Description

1. Technical field [0001] A Sn-Ag-Cu lead-free solder containing Nd, Li, As, and In is mainly used in the field of microelectronic packaging and surface assembly. It is a kind of solder with excellent solderability, creep resistance and good mechanical properties. The new lead-free solder belongs to metal materials and brazing materials in the field of metallurgy. 2. Background technology [0002] my country is currently the world's largest production base of electronic products, and the export markets of electronic products mainly face developed countries such as North America, the European Union, and Japan. In response to the arrival of the lead-free trend, the Ministry of Information Industry of the People's Republic of China, the National Development and Reform Commission, the Ministry of Commerce, the General Administration of Customs, the State Administration for Industry and Commerce, the State Administration of Quality Supervision, Inspection and Quarantine and the S...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 张亮薛松柏顾立勇顾文华
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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