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Welding method of aluminum target blank and aluminum alloy backboard

A welding method and aluminum alloy technology, applied in welding equipment, metal material coating process, welding/welding/cutting items, etc., can solve the problems of easy oxidation and affecting the welding effect of target components, etc., and achieve strong resistance to deformation under heat , Prevent oxidation and reduce cost

Inactive Publication Date: 2009-10-28
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The problem to be solved by the present invention is to provide a welding method of an aluminum target blank and an aluminum alloy back plate, which solves the problem that in the diffusion welding process, the contact surface of the aluminum target blank and the aluminum alloy back plate is easily oxidized in a heated state, which affects the obtained target. Welding effect of material components

Method used

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  • Welding method of aluminum target blank and aluminum alloy backboard
  • Welding method of aluminum target blank and aluminum alloy backboard
  • Welding method of aluminum target blank and aluminum alloy backboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The following are the process steps and welding results of diffusion welding between 99.995% high-purity Al target blank and 6061Al alloy back plate:

[0035] (1) Surface processing of the target blank and the back plate: machine the surface of the Al target blank and the surface of the 6061Al alloy back plate to make them bright, especially to make the surface finish of the two contact surfaces reach 0.2um.

[0036] (2) Chemical cleaning of the target blank and the back plate: the surface of the Al target blank and the 6061Al alloy back plate is cleaned with an organic solvent to remove soluble impurities on the surface. The organic solvent can be any one of isobutanol IBA, isopropanol IPA or mixed propanol IPB, preferably, isopropanol IPA is selected.

[0037] (3) Put the target blank and back plate into the vacuum bag:

[0038] First put the Al target blank and the 6061Al alloy back plate into a thin-walled vacuum sheath welded and formed, the vacuum sheath is 1.0mm...

Embodiment 2

[0045] The following are the process steps and welding results of diffusion welding between 99.99% high-purity Al target blank and 6061Al alloy back plate:

[0046] (1) Surface processing of the target blank and the back plate: machine the surface of the Al target blank and the surface of the 6061Al alloy back plate to make them bright, especially to make the surface finish of the two contact surfaces reach 3.2um.

[0047] (2) Chemical cleaning of the target blank and the back plate: the surface of the Al target blank and the 6061Al alloy back plate is cleaned with an organic solvent to remove soluble impurities on the surface. The organic solvent can be any one of isobutanol IBA, isopropanol IPA or mixed propanol IPB, preferably, isopropanol IPA is selected.

[0048] (3) Put the target blank and back plate into the vacuum bag:

[0049] First put the Al target blank and the 6061Al alloy back plate into a thin-walled vacuum sheath welded and formed, the vacuum sheath is 1.0mm ...

Embodiment 3

[0056] The following are the process steps and welding results of diffusion welding between 99.99% high-purity Al target blank and ZL105AL alloy back plate:

[0057] (1) Surface processing of the target blank and the back plate: machine the surface of the Al target blank and the surface of the ZL105AL alloy back plate to make them bright, especially to make the surface finish of the two contact surfaces reach 1.6um.

[0058] (2) Chemical cleaning of the target blank and the back plate: Clean the surface of the Al target blank and the ZL105AL alloy back plate with an organic solvent to remove soluble impurities on the surface. The organic solvent can be any one of isobutanol IBA, isopropanol IPA or mixed propanol IPB, preferably, isopropanol IPA is selected.

[0059] (3) Put the target blank and back plate into the vacuum bag:

[0060] First put the Al target blank and the ZL105AL alloy back plate into a thin-walled vacuum sheath welded and formed by welding 1.0mm to 2.0mm low...

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Abstract

A welding method of aluminum blank and aluminum alloy backboard comprises the following steps: providing an aluminum target blank and an aluminum alloy backboard; placing the aluminum target blank and the aluminum alloy backboard into a vacuum sheath and transferring into a welding device; adopting a hot isostatic pressing technique for diffusion welding, welding the aluminum target material blank to the aluminum alloy backboard for forming a target material assembly; and after the welding, executing air cooling and detaching the vacuum sheath and taking the target material assembly out. The invention adopts the vacuum sheath for realizing the isolation of target material from the backboard and the air. The oxidization on the surface of the metal in welding is effectively prevented and the cost of vacuum device is reduced. On the other hand, the hot isostatic pressing technique is used for the diffusion welding. The bonding strength between the aluminum target blank and the aluminum alloy backboard is effectively increased, and furthermore the bending deformation after bonding is little.

Description

technical field [0001] The invention relates to the manufacture of sputtering targets in the field of semiconductors, in particular to a welding method for an aluminum target blank and an aluminum alloy back plate. Background technique [0002] In the semiconductor industry, a target assembly is composed of a target that meets the sputtering performance and a back plate that is combined with the target and has a certain strength. The back plate can play a supporting role when the target assembly is assembled to the sputtering base, and has the effect of conducting heat. At present, metal tantalum (Ta) or aluminum (Al) is mainly used as a target material by physical vapor deposition (PVD) coating and forming a barrier layer, and magnetron sputtering is used in the sputtering process; it needs to be used with sufficient strength and thermal conductivity , and copper or aluminum materials with high conductivity are used as the backplane material. [0003] The high-purity alum...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/14B23K20/24C23G5/032B23K20/02C23C14/34B23K103/10
Inventor 姚力军潘杰王学泽陈勇军刘庆
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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