Transplanting method of multiplex circuit board

Abstract

The invention discloses a transplanting method of multiplex circuit boards, comprising the following steps: measuring the size of the multiplex circuit board of each batch number; sorting the multiplex circuit boards of different expansion-contraction levels through the statistical analysis of the measured data; selecting the multiplex circuit board of one level and cutting the multiplex circuit board to remove at least one poor circuit board to form a vacant position; selecting at least one good circuit board of same level, and reassembling and jointing the good circuit board to transplant the good circuit board to the vacant position, thereby the reassembled and jointed multiplex circuit boards have higher precision.

Description

technical field [0001] The invention relates to a multi-connection circuit board, in particular to a method for transplanting a multi-connection circuit board. Background technique [0002] At present, the manufacturing method of multi-circuit board is usually to make a printed circuit board (PCB panel) into multiple sub-circuit boards, so that the printed circuit board forms a multi-circuit board with 4, 6 or more sub-circuit boards. However, since the probability of defective products produced by these sub-circuit boards is about 5% to 7%, it would be a waste of resources if the defective products are discarded. Therefore, manufacturers of multi-connected circuit boards usually use The good product circuit board is removed as a spare circuit board, and then the spare circuit board is used to replace the damaged bad circuit board on other multi-connected circuit boards, so that all sub-circuit boards on the reorganized multi-connected circuit board are usable good products ...

AI Technical Summary

Problems solved by technology

However, this replacement structure is only applicable to printed circuit boards of the same type as good-quality single-chip printed circuit boards, which has limited practicability, and good-quality single-chip printed circuit boards must be fixed with plug-ins, thus increasing the complexity of the manufacturing process

[0005] In addition, the multi-circuit boards produced under different equipment or under the supply of substrate raw materials with different numbers, the size expansion and shrinkage of each batch of multi-circuit boards produced are also different, so even if it is For multi-circuit boards of the same type, the difference in size expansion and contraction is too large, which will also affect the accuracy of reassembly and bonding and the reliability of subsequent manufacturing processes

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