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Integrated silicon chip for testing acceleration, pressure and temperature, and manufacturing method thereof

A silicon chip and acceleration technology, used in the measurement of acceleration, speed/acceleration/shock measurement, thermometer, etc., can solve the problems of temperature drift, difficult to miniaturize, and the device cannot work, and achieves good accuracy, good stability, and high sensitivity. Effect

Active Publication Date: 2009-10-07
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] The manufacturing of absolute pressure sensor chips based on bulk micromachining has the following disadvantages: First, the resistance after power-on and the silicon substrate are isolated by pn junctions. When the temperature of the device is above 100°C, the pn junction leakage current is very large. Make the device inoperable and therefore unsuitable for use in stress testing in medium to high temperature environments
Therefore, it is not easy to miniaturize, and it is not compatible with the IC process
The piezoresistive accelerometer has the disadvantage of temperature drift, while the capacitive accelerometer has failure problems such as adhesion between the plates

Method used

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  • Integrated silicon chip for testing acceleration, pressure and temperature, and manufacturing method thereof
  • Integrated silicon chip for testing acceleration, pressure and temperature, and manufacturing method thereof

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Embodiment Construction

[0018] The substantive features and remarkable progress of the present invention will be further described below through specific implementation, but the present invention is by no means limited to the described embodiments.

[0019] like figure 1 Shown is an integrated silicon chip and its manufacturing method for testing acceleration, pressure and temperature. The scanning electron microscope photo of the graphic surface before bonding is inserted in the upper left corner for the heating resistor and temperature detection thermopile of the accelerometer. , and the upper right corner is a magnified view of the pressure sensor. The thickness h of the designed LS SiN structure layer is 1.2 μm, the polysilicon thin film forms a force sensitive resistor with a thickness of 0.3-0.6 μm, and the sacrificial layer thickness is 2 μm.

[0020] Concrete process implementation steps are as follows:

[0021] 1. Construct the sacrificial layer, define the polysilicon force sensitive res...

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Abstract

The invention relates to an integrated silicon chip for testing acceleration, pressure and temperature, and the manufacturing method thereof. The invention is characterized in manufacturing the pressure sensor, temperature sensor and accelerometers of thermoelectric pile on to one chip by the same micro processing technology. The acceleration is detected by adopting thermal convection type accelerometers, using polysilicon resistor as heater, using a thermoelectric pile composed of two pairs of metals (such as aluminium and tungsten-titanium) and P type or N type polysilicon to detect the temperature difference in the sealed cavity caused by acceleration. The high accurate absolute pressure sensor is manufactured by using silicon nitride film with low stress as the core structure layer of the pressure sensor chip, and forming force sensitive resistor track by polysilicon film, forming vacuum reference cavity by TEOS bolt in LPCVD furnace. At the same time, the temperature sensor is composed by using polysilicon thermistor to detect temperature change. The integrated chip achieves the advantages of microminiaturization, low cost, high precision, high reliability and high stability.

Description

technical field [0001] The present invention relates to a kind of test acceleration, the integrated silicon chip of pressure and temperature and its manufacturing method, more precisely, provide a kind of micromachining technology based on thermopile acceleration sensor (accelerometer), pressure sensor and temperature sensor to make On a chip, belonging to the field of silicon micromechanical sensor technology. Background technique [0002] In the fields of aerospace, industrial automation control, automotive electronics, navigation, and consumer electronics, parameters such as acceleration, pressure, and temperature need to be measured simultaneously. For example, in the automobile tire pressure detection system, the pressure sensor installed in each tire is used to directly measure the air pressure of the tire, and the air pressure of each tire is displayed and monitored. When the tire pressure is too low or there is leakage, the system will automatically Call the police....

Claims

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Application Information

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IPC IPC(8): G01P15/00G01L9/06G01K7/22B81B7/00B81C1/00
Inventor 李昕欣王权
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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