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Optical bonding composition for led light source

A technology of LED light source and adhesive layer, applied in the field of LED light source, can solve the problems of affecting the function of the LED light source, limiting the effectiveness, hindering the use of the extractor, etc.

Inactive Publication Date: 2009-09-30
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the difficulty of bonding the extractor to the LED die has hindered the use of the extractor
Known bonding methods require high temperatures (greater than 350°C) and high pressures, both of which negatively affect the functionality of the LED light source
Known bonding methods also require involved fabrication methods such as chemical vapor deposition, various forms of epitaxy, etc., which limit the effectiveness of these methods in select applications

Method used

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  • Optical bonding composition for led light source
  • Optical bonding composition for led light source
  • Optical bonding composition for led light source

Examples

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example

[0066] Surface modified zirconia nanoparticles were prepared as follows. Mix 100 grams of 23% by weight zirconia sol (25.5% by weight solids in water, solids being zirconia and acetic acid); 100 grams of 1-methoxy-2-propanol; and 5.45 grams of 2-[2- (2-Methoxyethoxy)ethoxy]acetic acid (MEEAA) to obtain a mixture with 1.2 mmoles of MEEAA per gram of zirconia. The mixture was placed on a rotary evaporator to remove solvent. A dry solid was obtained and the solid was further dried in a vacuum oven at 60°C for about 12 hours. The resulting dry powder was dispersed in 229.5 grams of methanol to form a translucent liquid with 12 wt% nanoparticles.

[0067] By vortexing 50 g of poly(phenylsiloxane) (C 6 h 5 SiO 1.5 ) x Glass resin pellets (GR-950 from Techneglas Ltd.) and 115 grams of acetone for 30 minutes until a clear solution was obtained to prepare a silicone solution comprising these two components.

[0068] A mixture was prepared by mixing 10 grams of the nanoparticle sol...

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Abstract

The present invention discloses an optical bonding composition and LED light source comprising the composition, as well as a method of making the LED light source. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising an amorphous organopolysiloxane network, the organopolysiloxane network comprising a silsesquioxane portion derived from (RSiO1.5)n wherein R is an organic group and n is an integer of at least 10; the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.

Description

[0001] Cross references to related patent applications [0002] This patent application claims priority to US Provisional Patent Application No. 60 / 866448, filed November 20, 2006, the disclosure of which is incorporated herein by reference in its entirety. technical field [0003] The present invention relates to LED light sources, and more particularly to LED light sources having an optical element bonded to an LED die using an optical bonding composition. Background technique [0004] LED light sources have the inherent potential to provide the brightness, output and operating life of conventional light sources. Unfortunately, LED light sources generate light in a semiconductor material commonly referred to as an LED die, and it is difficult to efficiently extract light from the LED die without substantially reducing brightness or increasing the apparent light-emitting area of ​​the LED light source. This difficulty typically arises from a large refractive index mismatc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00F21S8/04H01L33/58
CPCH01L33/58F21V7/0091F21Y2101/02F21Y2115/10H01L2924/0002H01L2924/00
Inventor 埃米·S·巴尔内斯D·斯科特·汤姆森托德·A·巴伦
Owner 3M INNOVATIVE PROPERTIES CO
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